XA6SLX16-2FTG256Q

The XA6SLX16-2FTG256Q is a Spartan®-6 LX field programmable gate array (FPGA) offered by AMD. It integrates 14,579 logic elements and approximately 0.59 Mbits of embedded memory with 186 user I/Os in a 256-ball BGA package, delivering a compact, programmable fabric for system-level customization.

Qualified to AEC‑Q100 and specified for operation from -40 °C to 125 °C, this device targets designs that require automotive-grade qualification, surface-mount packaging, and a defined low-voltage supply range of 1.14 V to 1.26 V.

Key Features

• Logic Capacity — 14,579 logic elements available for implementing custom digital functions and control logic.
• Embedded Memory — Approximately 0.59 Mbits of on-chip RAM for buffering, state storage, and small lookup tables.
• I/O Density — 186 user I/Os to support multiple interfaces and signal routing needs within a compact package.
• Automotive Qualification — AEC‑Q100 qualification and Automotive grade designation for use in applications requiring that level of qualification.
• Package and Mounting — 256-LBGA (supplier package 256-FTBGA, 17×17) in a surface-mount form factor for board-level integration.
• Voltage and Power — Core supply range specified from 1.14 V to 1.26 V to match system power designs.
• Temperature Range — Rated for operation from -40 °C to 125 °C for extended temperature environments.
• RoHS Compliance — Component is RoHS compliant for environmental and assembly considerations.

Typical Applications

• Automotive systems — Engine control, sensor interface, and other in-vehicle logic where AEC‑Q100 qualification and extended temperature operation are required.
• Embedded control — Custom control logic and glue-logic functions leveraging 14,579 logic elements and multiple I/Os for device orchestration.
• Signal buffering and small-memory tasks — Use the on-chip memory for buffering, FIFOs, and small lookup tables in data-path or control applications.
• Compact board designs — 256-LBGA surface-mount package suited to space-constrained PCBs requiring moderate I/O counts.

Unique Advantages

• Automotive-qualified silicon: AEC‑Q100 qualification and Automotive grade designation provide a known qualification level for vehicle system designs.
• Balanced logic and memory: 14,579 logic elements combined with approximately 0.59 Mbits of embedded RAM enable a wide range of custom logic and buffering tasks without external memory for small datasets.
• Generous I/O in a compact package: 186 user I/Os in a 256-ball BGA enable multiple interface connections while maintaining a small board footprint.
• Wide operating temperature: Specified -40 °C to 125 °C operation supports deployment in harsh thermal environments.
• Tight core voltage specification: A defined supply range (1.14 V to 1.26 V) simplifies power-supply planning and integration.
• Surface-mount compatibility: 256-LBGA / 256-FTBGA (17×17) supplier package supports modern SMT assembly processes.

Why Choose XA6SLX16-2FTG256Q?

The XA6SLX16-2FTG256Q positions itself as an automotive‑qualified FPGA option that balances logic density, embedded memory, and I/O capability in a compact 256-LBGA package. Its AEC‑Q100 qualification and -40 °C to 125 °C operating range make it suitable for designs where qualification and extended temperature are required.

Designers seeking a programmable device from AMD with clearly specified logic capacity (14,579 logic elements), approximately 0.59 Mbits of on-chip RAM, and 186 I/Os will find this part appropriate for embedded control, interface consolidation, and space-constrained boards where automotive-level qualification is a requirement.

If you would like pricing, availability, or to request a quote for XA6SLX16-2FTG256Q, please submit an inquiry or request a quote from our sales team today.