XA6SLX16-3FTG256Q

The XA6SLX16-3FTG256Q is a Spartan®-6 LX Field Programmable Gate Array from AMD, supplied in a 256-LBGA (256-FTBGA, 17×17) surface-mount package. It integrates mid-range logic capacity and on-chip memory with a broad I/O count and automotive-focused qualification for robust embedded applications.

With 1,139 configurable logic blocks delivering approximately 14,579 logic elements, roughly 0.59 Mbits of embedded memory, 186 I/Os, and an operating range from -40 °C to 125 °C, this device targets automotive and other high-reliability systems that require compact, low-voltage programmable logic.

Key Features

• Core Logic  1,139 configurable logic blocks providing approximately 14,579 logic elements for mid-range programmable logic implementation.
• Embedded Memory  Approximately 0.59 Mbits (589,824 bits) of on-chip RAM to support buffering, state storage, and small-scale data processing.
• I/O Capacity  186 I/O pins suitable for a variety of digital interfaces and signal routing needs on compact boards.
• Power  Core supply range of 1.14 V to 1.26 V for compatibility with low-voltage system architectures.
• Package & Mounting  256-LBGA package (supplier device package: 256-FTBGA, 17×17) in a surface-mount form factor for space-efficient PCB integration.
• Automotive Qualification  Automotive grade with AEC‑Q100 qualification and an operating temperature range of -40 °C to 125 °C for use in demanding environmental conditions.
• Compliance  RoHS-compliant construction for regulatory and environmental consistency.

Typical Applications

• Automotive control modules  Use in vehicle subsystems where AEC‑Q100 qualification and -40 °C to 125 °C operation are required for reliable on-board logic and I/O tasks.
• Embedded signal processing  On-chip memory and mid-range logic resources enable buffering, custom signal paths, and control functions in embedded systems.
• Protocol bridging and I/O expansion  The 186 I/Os make this device suitable for protocol conversion, bus bridging, and expanding digital interfaces in constrained board space.
• Ruggedized electronics  Automotive-grade qualification and wide temperature range support designs targeting harsh or variable operating environments.

Unique Advantages

• Automotive-qualified reliability: AEC‑Q100 qualification and extended temperature rating provide traceable suitability for automotive environments.
• Balanced logic and memory: Approximately 14,579 logic elements paired with ~0.59 Mbits of on-chip RAM for mid-range integration without external memory.
• High I/O count in a compact package: 186 I/Os in a 256-LBGA (17×17) package reduce board complexity while supporting diverse signal requirements.
• Low-voltage core compatibility: 1.14 V to 1.26 V supply range aligns with modern low-voltage system architectures.
• Compliance and manufacturability: Surface-mount LBGA packaging and RoHS compliance simplify production and regulatory adherence.

Why Choose XA6SLX16-3FTG256Q?

The XA6SLX16-3FTG256Q positions itself as a practical, automotive-grade FPGA choice for engineers needing mid-range logic density, modest embedded memory, and substantial I/O capability in a compact LBGA package. Its AEC‑Q100 qualification and extended temperature range make it suitable for designs that demand higher environmental robustness.

This device is well suited for customers designing automotive subsystems, rugged embedded controllers, and compact I/O-expansion solutions where predictable power requirements (1.14 V–1.26 V), surface-mount packaging, and RoHS compliance are important to long-term product integration and manufacturability.

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