XA6SLX25-2CSG324I

The XA6SLX25-2CSG324I is a Spartan®-6 LX field programmable gate array (FPGA) IC from AMD, delivered in a 324-CSPBGA (15×15) surface-mount package. It combines substantial logic capacity, embedded memory, and a high I/O count in an automotive-qualified footprint for board-level digital processing.

With 24,051 logic elements, approximately 0.96 Mbits of embedded RAM, and 226 user I/Os, this device is suited to applications that require compact, predictable FPGA resources and a defined electrical and thermal envelope for demanding environments.

Key Features

• Core Logic — 24,051 logic elements provide a balance of combinational and sequential resources for implementing custom digital logic and control functions.
• Configurable Logic Blocks (CLBs) — 1,879 CLBs available for structuring logic, state machines, and processing pipelines.
• Embedded Memory — Approximately 0.96 Mbits of on-chip RAM to support buffering, lookup tables, and small data stores without external memory.
• High I/O Count — 226 user I/Os to interface with sensors, peripherals, and host systems across multiple parallel and serial domains.
• Power — Specified core voltage supply range of 1.14 V to 1.26 V for consistent power-domain planning and supply design.
• Package and Mounting — 324-LFBGA (324-CSPBGA, 15×15) surface-mount package that supports compact board layouts and dense integration.
• Temperature and Qualification — Operating temperature range of −40 °C to 100 °C and AEC-Q100 qualification, supporting automotive-grade deployment scenarios.
• Regulatory — RoHS-compliant material status for environmental and manufacturing compliance.

Typical Applications

• Automotive systems — Suitable for control and interface functions in automotive electronic modules where AEC-Q100 qualification and −40 °C to 100 °C operation are required.
• Compact board-level FPGA processing — 324-CSPBGA package and surface-mount mounting enable space-constrained designs that require substantial logic and memory on a small footprint.
• High-density I/O designs — 226 I/Os support applications needing broad peripheral interfacing and signal aggregation on a single FPGA.
• Embedded buffering and lookup — Approximately 0.96 Mbits of on-chip RAM for local data storage, buffering, and table-based logic without external memory.

Unique Advantages

• Automotive-qualified platform: AEC-Q100 qualification aligns the device with automotive reliability and quality expectations where specified.
• Substantial logic capacity: 24,051 logic elements enable implementation of complex control, signal processing, and glue-logic functions on-chip.
• High I/O integration: 226 user I/Os reduce the need for external interface components and simplify board-level routing for multi-peripheral systems.
• Compact, solderable package: 324-CSPBGA (15×15) surface-mount package supports dense system integration and compact PCB layouts.
• Predictable power domain: Narrow core voltage range (1.14 V–1.26 V) aids in power-supply design and thermal planning.
• Wide operating temperature: −40 °C to 100 °C operation suits deployments across variable thermal environments.

Why Choose XA6SLX25-2CSG324I?

The XA6SLX25-2CSG324I provides a balanced combination of logic density, embedded memory, and a high I/O count in a compact 324-CSPBGA package, backed by AMD’s Spartan®-6 LX family pedigree. Its AEC-Q100 qualification and wide operating temperature range make it appropriate for automotive and other applications that require defined quality and thermal performance.

This device is a practical choice for designs that need on-chip memory for buffering and lookup, significant programmable logic resources, and extensive I/O in a surface-mount, space-efficient form factor. Its electrical and mechanical specs support predictable integration into systems where package size, power domain, and environmental range are key design drivers.

Request a quote or submit a pricing inquiry to evaluate XA6SLX25-2CSG324I for your next design and confirm availability and lead times.