XA6SLX25T-2FGG484Q

IC FPGA 250 I/O 484FBGA
Part Description

Spartan®-6 LXT XA Field Programmable Gate Array (FPGA) IC 250 958464 24051 484-BBGA

Quantity 1,236 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeAutomotiveOperating Temperature-40°C – 125°C
Package / Case484-BBGANumber of I/O250Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1879Number of Logic Elements/Cells24051
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationAEC-Q100Total RAM Bits958464

Overview of XA6SLX25T-2FGG484Q – Spartan®-6 LXT XA Field Programmable Gate Array (FPGA) IC

The XA6SLX25T-2FGG484Q is a Spartan®-6 LXT XA field programmable gate array (FPGA) IC manufactured by AMD. It provides a balance of logic capacity, embedded memory, and high I/O count in a compact 484-ball BGA package.

With 24,051 logic elements, approximately 0.96 Mbits of embedded memory, 250 I/Os and AEC-Q100 qualification, this device is positioned for applications that require a qualified, programmable logic solution across a wide operating temperature range and low-voltage core operation.

Key Features

  • Core & Logic: Contains 24,051 logic elements and 1,879 logic blocks, delivering substantial programmable logic resources for custom digital designs.
  • Embedded Memory: Approximately 0.96 Mbits of on-chip RAM to support buffering, state storage, and local data processing.
  • I/O Capability: 250 user I/O pins to support multiple interfaces and complex system interconnects.
  • Power Supply: Low-voltage core operation with a supply range of 1.14 V to 1.26 V.
  • Package & Mounting: 484-ball BGA package (supplier package: 484-FBGA, 23 × 23 mm) designed for surface-mount assembly.
  • Temperature Range: Rated for operation from −40 °C to 125 °C to meet demanding thermal environments.
  • Automotive Qualification: Automotive grade with AEC-Q100 qualification for designs requiring this industry standard.
  • Regulatory Compliance: RoHS-compliant for environmentally conscious designs.

Unique Advantages

  • Automotive-ready qualification: AEC-Q100 certification and an operating range of −40 °C to 125 °C make the device suitable for automotive-grade applications that require qualified components.
  • Generous logic and memory integration: 24,051 logic elements paired with approximately 0.96 Mbits of embedded RAM support complex logic implementations without extensive external memory.
  • High I/O density: 250 I/O pins enable broad interfacing capability for multi-channel, multi-peripheral designs.
  • Compact BGA footprint: 484-BBGA (484-FBGA, 23 × 23 mm) balances board-space efficiency with high pin count for dense system integration.
  • Low-voltage operation: 1.14–1.26 V core supply supports integration into low-voltage power architectures.
  • RoHS compliance: Environmentally compliant manufacturing supports global product requirements.

Why Choose XA6SLX25T-2FGG484Q?

The XA6SLX25T-2FGG484Q is a practical choice for engineers seeking a qualified FPGA with mid-range logic capacity and on-chip memory, a high I/O count, and a compact BGA package. Its AEC-Q100 qualification and wide operating temperature range make it suitable for applications that demand proven component qualifications and robust thermal performance.

Manufactured by AMD, this device provides a combination of programmable logic resources, embedded memory and interface capability that fits designs requiring deterministic, on-board logic and interfacing in constrained board space and low-voltage systems.

If you would like pricing or availability information, request a quote or contact sales to submit a quote for the XA6SLX25T-2FGG484Q.

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