XA6SLX4-2CSG225I

The XA6SLX4-2CSG225I is a Spartan®-6 LX field programmable gate array (FPGA) IC supplied in a 225-ball LFBGA/CSPBGA package. It delivers a moderate logic capacity with embedded memory and a flexible I/O count for embedded and automotive designs.

With AEC‑Q100 qualification, a wide operating temperature range and a low-voltage core, this device is positioned for applications that require automotive-grade qualification together with moderate on-chip logic, memory and I/O resources.

Key Features

• Core logic  Approximately 3,840 logic elements to implement custom logic, state machines and glue logic.
• Embedded memory  Approximately 0.22 Mbits (221,184 bits) of on-chip RAM for buffering, FIFOs and small data stores.
• I/O  132 available I/O pins to support multiple external interfaces, sensor connections and control signals.
• Power  Core supply voltage range from 1.14 V to 1.26 V, enabling design compatibility with low-voltage power domains.
• Package & mounting  225-ball LFBGA / 225-CSPBGA (13×13) package for surface-mount PCB assembly in compact footprints.
• Temperature & qualification  Operating range from −40 °C to 100 °C and AEC‑Q100 qualification for automotive-grade applications.
• Environmental compliance  RoHS compliant.

Typical Applications

• Automotive control and sensor interfacing  AEC‑Q100 qualification and −40 °C to 100 °C operation make the device suitable for control functions and sensor I/O in automotive electronic modules.
• Custom I/O expansion  132 I/O pins allow the FPGA to implement protocol bridging, signal aggregation and custom interface logic for embedded systems.
• Moderate-density logic implementations  Approximately 3,840 logic elements and on-chip RAM support glue logic, state machines and packet buffering in compact FPGA-based designs.

Unique Advantages

• Automotive-qualified silicon  AEC‑Q100 qualification and extended temperature rating provide confidence for vehicle-level applications.
• Balanced logic and memory  The combination of ~3,840 logic elements and ~0.22 Mbits of RAM supports a range of low-to-moderate complexity functions without external memory.
• Generous I/O count  132 I/O pins enable flexible interfacing with sensors, actuators and peripheral devices, reducing the need for additional bridge components.
• Compact, industry-standard package  225-ball LFBGA / CSPBGA (13×13) footprint helps save PCB area while supporting surface-mount assembly.
• Low-voltage core  1.14–1.26 V core supply supports integration into low-voltage power architectures.
• RoHS compliant  Meets environmental compliance requirements for modern electronics manufacturing.

Why Choose XA6SLX4-2CSG225I?

The XA6SLX4-2CSG225I delivers a practical balance of logic capacity, embedded RAM and I/O density in an automotive-qualified FPGA package. Its AEC‑Q100 qualification, wide temperature range and surface-mount 225-ball package make it a fit for designs that require qualified components and flexible I/O in a compact footprint.

This device is well suited to engineers developing automotive modules, embedded controllers and custom interface logic that require a combination of moderate programmable logic, on-chip memory and robust operating conditions.

Request a quote or contact sales to discuss availability, lead times and pricing for the XA6SLX4-2CSG225I.