XA6SLX4-2CSG225Q

The XA6SLX4-2CSG225Q is a Spartan®-6 LX field programmable gate array (FPGA) in a 225-pin CSPBGA / LFBGA package. It provides a compact, qualified FPGA option with a defined set of logic, embedded memory, and I/O resources for designs that require on-chip programmability.

With 3,840 logic elements, approximately 0.22 Mbits of embedded RAM and 132 user I/O connections, this device targets embedded and automotive-aware applications that need deterministic component qualifications and a wide operating temperature range.

Key Features

• Core Logic  Provides 3,840 logic elements suitable for implementing moderate-complexity digital functions and glue logic.
• Embedded Memory  Includes 221,184 total RAM bits (approximately 0.22 Mbits) for on-chip data buffering, small FIFOs and state storage.
• I/O Capacity  Offers 132 user I/O pins to interface with sensors, peripherals and external logic.
• Power  Operates from a core supply range of 1.14 V to 1.26 V, enabling deterministic power planning for system designers.
• Package & Mounting  Supplied in a 225-pin CSPBGA / LFBGA footprint (225-CSPBGA, 13×13) for surface-mount assembly in space-constrained PCBs.
• Automotive Qualification  Grade: Automotive with AEC-Q100 qualification, and an extended operating temperature range of −40 °C to 125 °C for demanding environments.
• RoHS Compliance  Manufactured in accordance with RoHS directives for lead-free assembly requirements.

Typical Applications

• Automotive control systems  AEC-Q100 qualification and −40 °C to 125 °C operation make this FPGA suitable for automotive electronic modules that require programmable logic and on-chip RAM.
• Embedded signal glue logic  3,840 logic elements and 132 I/Os are well matched to implement protocol bridging, timing control and peripheral aggregation in embedded designs.
• Sensor interfacing and aggregation  On-chip RAM and a broad I/O count support local buffering and aggregation of sensor data before transfer to system controllers.

Unique Advantages

• Qualified for automotive use  AEC-Q100 qualification and an extended temperature rating support deployment in temperature-stressed environments.
• Right-sized logic capacity  3,840 logic elements provide a balance between capability and cost for mid-range programmable designs.
• Compact surface-mount package  225-CSPBGA (13×13) enables high-density PCB layouts while preserving significant I/O and memory resources.
• Deterministic supply requirements  A defined core voltage range (1.14 V–1.26 V) simplifies power sequencing and system-level power budgeting.
• RoHS compliant  Meets lead-free manufacturing requirements for modern production processes.

Why Choose XA6SLX4-2CSG225Q?

The XA6SLX4-2CSG225Q delivers a focused mix of logic density, embedded RAM and I/O capability in a compact, automotive-qualified package. It is suited to designers who need a programmable logic device with defined electrical and thermal bounds—3,840 logic elements, roughly 0.22 Mbits of RAM, 132 I/Os, and operation from −40 °C to 125 °C under AEC-Q100 qualification.

This FPGA is a practical choice for teams implementing mid-complexity control, interfacing and buffering functions in space-constrained boards where component qualification and predictable supply requirements matter.

Request a quote or submit your requirements to receive pricing and availability for the XA6SLX4-2CSG225Q.