XA6SLX25T-3FGG484Q

The XA6SLX25T-3FGG484Q is a Spartan®-6 LXT field programmable gate array (FPGA) from AMD, offered in a 484-BBGA (23×23) surface-mount package. It delivers mid-range programmable logic capacity, on-chip RAM, and a high I/O count in an AEC-Q100 qualified, automotive-grade device.

This device is suitable for designs that require a balance of logic resources, embedded memory, and system I/O while meeting automotive qualification and extended temperature requirements.

Key Features

• Logic Resources — 24,051 logic element cells providing mid-range programmable logic capacity for custom digital functions.
• Configurable Logic Blocks (CLBs) — 1,879 CLBs to structure and implement combinational and sequential logic.
• Embedded Memory — Approximately 0.96 Mbits (958,464 bits) of on-chip RAM for data buffering, state storage, and small local memory needs.
• High I/O Count — 250 I/O pins to support multiple interfaces and system interconnects.
• Power — Core supply voltage range of 1.14 V to 1.26 V for device operation.
• Package & Mounting — 484-BBGA package (supplier device package: 484-FBGA, 23×23) intended for surface-mount PCB assembly.
• Automotive Qualification & Temperature Range — Automotive grade with AEC-Q100 qualification and an operating temperature range of −40 °C to 125 °C for harsh-environment applications.
• Compliance — RoHS compliant.

Typical Applications

• Automotive control systems — Implement custom logic for vehicle subsystems where AEC-Q100 qualification and wide temperature range are required.
• Sensor interfacing and signal conditioning — Aggregate and preprocess sensor data using on-chip logic and memory before handing off to system controllers.
• Embedded system bridging and I/O expansion — Provide flexible protocol translation and interface consolidation with a large number of I/O pins.

Unique Advantages

• Automotive-qualified device: AEC-Q100 qualification supports deployment in automotive environments that require component-level automotive grading.
• Balanced mid-range resources: 24,051 logic elements and approximately 0.96 Mbits of embedded memory enable integration of multiple functions without excessive external components.
• Generous I/O capacity: 250 I/Os allow connection to numerous sensors, actuators, and peripheral devices without additional interface chips.
• Wide operating temperature: −40 °C to 125 °C rating supports reliable operation across demanding ambient conditions.
• Compact surface-mount package: 484-BBGA (23×23) minimizes PCB footprint while maintaining robust pin count for complex systems.
• Regulatory compliance: RoHS compliance simplifies material-conformity planning for production programs.

Why Choose XA6SLX25T-3FGG484Q?

The XA6SLX25T-3FGG484Q positions itself as an automotive-grade, mid-range FPGA that combines substantial logic capacity, embedded memory, and a high I/O count in a compact 484-BBGA package. Its AEC-Q100 qualification and −40 °C to 125 °C operating range make it suitable for designs where automotive qualification and environmental robustness are required.

This device is ideal for engineers building vehicle subsystems, sensor interfaces, and embedded controllers that need programmable logic integration with qualified component status and a balance of performance and integration to reduce external BOM and support long-term deployment.

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