XA6SLX25-3FTG256Q

The XA6SLX25-3FTG256Q is a Spartan®-6 LX XA Field Programmable Gate Array (FPGA) designed for applications requiring reconfigurable logic in a compact, automotive-qualified package. It integrates a substantial logic fabric with embedded memory and a high pin count to support a range of embedded and vehicle-grade applications.

This device offers 24,051 logic elements, approximately 0.96 Mbits of on-chip RAM, and 186 I/O pins, combined with AEC-Q100 qualification, a tight core supply range (1.14 V–1.26 V) and an operating temperature range of −40 °C to 125 °C—attributes that support reliability under demanding environmental conditions.

Key Features

• Core & Logic 24,051 logic elements provide flexible, reprogrammable digital logic resources for custom function implementation.
• Embedded Memory Approximately 0.96 Mbits of on-chip RAM for buffering, lookup tables, and small data stores close to logic.
• I/O & Connectivity 186 general-purpose I/O pins enable dense external interfacing and high pin-count designs in a compact footprint.
• Power & Voltage Specified core supply voltage range of 1.14 V to 1.26 V for deterministic power design and supply planning.
• Package & Mounting 256-LBGA (supplier package: 256-FTBGA, 17×17) in a surface-mount format for space-efficient board layouts.
• Temperature Range & Qualification Operating from −40 °C to 125 °C and AEC-Q100 qualified for automotive-grade deployment.
• Environmental Compliance RoHS compliant to meet common environmental and regulatory requirements.

Typical Applications

• Automotive control systems — AEC-Q100 qualification and wide operating temperature make this FPGA suitable for in-vehicle control logic and electronic modules.
• In-vehicle sensor and signal processing — On-chip RAM and abundant logic elements support real-time preprocessing and interface handling for sensors.
• Custom embedded logic — High I/O count and flexible logic resources enable tailored interfaces and protocol bridging in compact designs.
• Ruggedized embedded systems — Extended temperature rating and automotive qualification support deployment in thermally and environmentally challenging conditions.

Unique Advantages

• Highly integrated logic and memory: 24,051 logic elements plus approximately 0.96 Mbits of embedded RAM reduce the need for external logic and memory components.
• Automotive-qualified: AEC-Q100 qualification provides explicit suitability for automotive electronics development and design-in confidence.
• Wide operating temperature: Rated from −40 °C to 125 °C for reliable operation in harsh thermal environments.
• Compact, high-density package: 256-LBGA (17×17 FTBGA) enables a small board footprint while supporting 186 I/O pins for complex interconnects.
• Predictable power requirements: Narrow core voltage range (1.14 V–1.26 V) aids in power-supply design and stability.
• RoHS compliant: Simplifies compliance with lead-free and environmental regulations.

Why Choose XA6SLX25-3FTG256Q?

The XA6SLX25-3FTG256Q positions itself as a robust, automotive-grade FPGA option that balances significant programmable logic resources, embedded memory, and a high I/O count in a compact 256-LBGA package. Its AEC-Q100 qualification and extended temperature range make it appropriate for vehicle electronics and other demanding embedded applications where thermal and reliability constraints are critical.

Design teams seeking a scalable, reprogrammable platform with clear electrical and environmental specifications will find this FPGA suitable for designs that require integration, predictable power planning, and manufacturer-backed documentation.

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