XA6SLX25-3FTG256I

The XA6SLX25-3FTG256I is a Spartan®-6 LX XA field programmable gate array (FPGA) IC from AMD. It delivers a balanced mix of logic capacity, embedded memory, and I/O density in a compact 256-ball LBGA package for embedded designs that require programmable logic and interfacing.

With approximately 24,051 logic elements, about 0.96 Mbits of on‑chip RAM, 186 I/O pins, AEC‑Q100 qualification and an operating range from -40°C to 100°C, this device is specified for applications that demand a rugged temperature range and automotive qualification.

Key Features

• Core Logic Approximately 24,051 logic elements suitable for medium-complexity custom logic and control functions.
• Embedded Memory Approximately 0.96 Mbits of on‑chip RAM to support buffering, look‑up tables and temporary storage within designs.
• I/O Density 186 general-purpose I/O pins to support multiple interfaces and parallel connections to sensors, actuators and peripherals.
• Package 256‑LBGA package (supplier package: 256‑FTBGA, 17×17) for a compact board footprint and high pin density.
• Power Core supply voltage range of 1.14 V to 1.26 V to match controlled FPGA power rails.
• Temperature & Qualification Operating temperature range of -40°C to 100°C and AEC‑Q100 qualification for automotive applications.
• Mounting & Compliance Surface mount device with RoHS compliance for modern assembly processes and environmental standards.

Typical Applications

• Automotive electronic control units (ECUs) Automotive-grade qualification and extended temperature range make this FPGA suitable for in-vehicle control and interface tasks.
• Embedded system control Use the device for custom control logic, protocol bridging and real‑time signal handling where on‑chip logic and RAM are needed.
• Sensor interfacing and data aggregation High I/O count allows direct connection to multiple sensors and peripherals for local preprocessing and aggregation.
• Prototyping and custom IP integration The combination of logic elements and embedded memory supports development and validation of tailored digital functions.

Unique Advantages

• Automotive-qualified design: AEC‑Q100 qualification provides assurance of suitability for automotive electronic applications.
• Ample programmable resources: Roughly 24,051 logic elements let you implement medium-complexity digital designs without external glue logic.
• Significant on‑chip RAM: Approximately 0.96 Mbits of embedded memory reduces the need for external RAM in many buffering and LUT use cases.
• Generous I/O count: 186 I/O pins support multiple parallel interfaces and flexible system integration.
• Compact, manufacturable package: 256‑LBGA (256‑FTBGA 17×17) provides high pin density in a small board footprint for space-constrained designs.
• Wide operating conditions: Specified operation from -40°C to 100°C and RoHS compliance support deployment in harsh environments and modern manufacturing.

Why Choose XA6SLX25-3FTG256I?

The XA6SLX25-3FTG256I combines a practical mix of logic capacity, embedded memory and a high I/O count in an automotive‑qualified package. Its specified core voltage range, extended temperature rating and AEC‑Q100 qualification make it a dependable option for designers targeting automotive and rugged embedded applications that require on‑board programmability.

This FPGA is well suited for teams needing a compact, automotive‑grade programmable device with predictable electrical and thermal specifications, enabling streamlined system designs with reduced external components and the flexibility to implement custom digital functions.

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