XA6SLX45-2CSG324Q

The XA6SLX45-2CSG324Q is an AMD Spartan®-6 LX XA field programmable gate array supplied in a 324‑CSPBGA (15×15) / 324‑LFBGA package. It delivers a balanced combination of programmable logic, embedded memory, and I/O density for designs that require on-chip customization and hardware-accelerated functions.

Qualified to AEC‑Q100 and rated for operation from ‑40 °C to 125 °C, this surface-mount FPGA targets applications demanding automotive-grade qualification, robust thermal range, and a compact BGA footprint. Its core supply operates from 1.14 V to 1.26 V and the device is RoHS compliant.

Key Features

• Logic Capacity  Provides 43,661 logic elements suitable for implementing custom combinational and sequential logic functions.
• Embedded Memory  Approximately 2.14 Mbits of on-chip RAM for buffering, small data stores, and state machines.
• I/O Density  Up to 218 user I/O pins to support multiple interfaces, signal aggregation, and board-level connectivity.
• Automotive Qualification  AEC‑Q100 qualified and specified as automotive grade, making it appropriate for many in-vehicle applications.
• Operating Range  Qualified for operation from ‑40 °C to 125 °C to meet wide-temperature system requirements.
• Power  Core supply voltage range of 1.14 V to 1.26 V for defined power domain integration.
• Package and Mounting  324‑CSPBGA (15×15) / 324‑LFBGA surface-mount package for compact, board-level implementations.
• Standards Compliance  RoHS compliant for regulatory and assembly considerations.

Typical Applications

• Automotive Control Systems  Engine control modules, body electronics, and other in-vehicle systems that require AEC‑Q100 qualification and wide operating temperature range.
• Industrial Control  PLC I/O aggregation, protocol bridging, and machine control where reliable operation across extended temperatures is required.
• Signal Processing and Custom Logic  On-board acceleration for real-time deterministic tasks using the device’s programmable logic and embedded RAM.
• Interface and Connectivity  High-density I/O supports multi-channel sensor interfaces, protocol conversion, and board-level signal routing.

Unique Advantages

• AEC‑Q100 Automotive Qualification: Enables use in automotive systems that require supplier qualification and temperature robustness.
• High Logic and I/O Density: 43,661 logic elements and 218 I/Os let designers implement complex functions and multiple interfaces without external glue logic.
• On-Chip Memory: Approximately 2.14 Mbits of embedded memory reduces dependence on external RAM for many buffering and state requirements.
• Compact BGA Package: 324‑CSPBGA (15×15) delivers high integration in a small board footprint for space-constrained designs.
• Wide Temperature Range: Rated from ‑40 °C to 125 °C to support deployment in harsh thermal environments.
• Regulatory Compliance: RoHS compliance simplifies selection for environmentally regulated product lines.

Why Choose XA6SLX45-2CSG324Q?

The XA6SLX45-2CSG324Q positions itself as a versatile, automotive‑qualified FPGA that combines substantial logic capacity, embedded memory, and high I/O count in a compact 324‑CSPBGA package. Its AEC‑Q100 qualification and wide operating temperature range make it suitable for designers targeting automotive and industrial applications with demanding environmental requirements.

Engineers and procurement teams benefit from a solution that consolidates multiple functions on-chip—reducing BOM complexity and enabling hardware-level customization—while relying on AMD as the device manufacturer for established supply and documentation support.

Request a quote or submit your requirements for the XA6SLX45-2CSG324Q to receive pricing and availability information.