XA6SLX45-2FGG484Q

The XA6SLX45-2FGG484Q is a Spartan®-6 LX field programmable gate array (FPGA) from AMD. It integrates 43,661 logic elements and approximately 2.14 Mbits of embedded memory in a 484-ball BGA package designed for surface-mount assembly.

Targeted toward applications that require high logic density, extensive I/O and operation across an extended temperature range, this device is qualified to AEC‑Q100 and rated for automotive-grade operation from -40 °C to 125 °C. Supply voltage is specified between 1.14 V and 1.26 V.

Key Features

• Logic Capacity — 43,661 logic elements provide substantial programmable fabric for custom digital logic and control functions.
• On-chip Memory — Approximately 2.14 Mbits of embedded RAM for local buffering, state storage and implementing memory-mapped logic.
• I/O Density — 316 user I/O pins support complex interface requirements and multiple peripherals on a single device.
• Power Supply — Operates from a core supply range of 1.14 V to 1.26 V for compatibility with defined power domains.
• Package & Mounting — 484‑BBGA (supplier device package: 484‑FBGA, 23×23) in a surface-mount format for compact, board-level integration.
• Automotive Qualification — AEC‑Q100 qualification and an automotive grade rating enable deployment in temperature- and reliability-sensitive vehicle environments.
• Extended Temperature Range — Rated for -40 °C to 125 °C to support harsh operating conditions.
• RoHS Compliant — Meets RoHS environmental requirements for lead-free assembly and materials.

Typical Applications

• Automotive Electronics — Use in vehicle control and sensor subsystems that require AEC‑Q100 qualification and extended temperature operation.
• High‑I/O Control Systems — Suitable for board-level designs needing large I/O counts to interface with multiple peripherals and sensors.
• Embedded Logic and Glue — Implement custom logic, protocol bridging and glue logic where significant on-chip memory and logic elements are required.
• Compact Board Integration — The 484‑BBGA surface-mount package supports dense, compact PCB designs where board area is constrained.

Unique Advantages

• Automotive-Grade Qualification: AEC‑Q100 qualification and an operating range to 125 °C provide assurance for vehicle-focused designs that demand reliability.
• High Logic Density: 43,661 logic elements enable substantial integration of custom logic functions, reducing the need for multiple discrete devices.
• Ample Embedded Memory: Approximately 2.14 Mbits of on-chip RAM supports buffering and stateful logic close to the processing fabric.
• Large I/O Count: 316 I/O pins allow direct interfacing with a wide array of peripherals, sensors and communication lines without external multiplexing.
• Compact, Surface‑Mount Package: The 484‑BBGA (23×23) package provides a space-efficient footprint suitable for modern PCBs and high-density assemblies.
• RoHS Compliant: Conforms to lead-free manufacturing requirements for environmentally conscious production.

Why Choose XA6SLX45-2FGG484Q?

The XA6SLX45-2FGG484Q combines substantial programmable logic and embedded memory with a high I/O count and automotive-grade qualification, positioning it for designs that require integration, reliability and operation across wide temperature ranges. Its 484‑BBGA surface-mount package supports compact board layouts while the AEC‑Q100 qualification addresses stringent automotive requirements.

This device is well suited for engineers and procurement teams designing automotive subsystems, high-density control electronics and compact embedded platforms that demand verified qualification, significant on-chip resources and a robust operating envelope.

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