XA6SLX45-3CSG484I

IC FPGA 320 I/O 484CSBGA
Part Description

Spartan®-6 LX XA Field Programmable Gate Array (FPGA) IC 320 2138112 43661 484-FBGA, CSPBGA

Quantity 69 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time13 Weeks
Datasheet

Specifications & Environmental

Device Package484-CSPBGA (19x19)GradeAutomotiveOperating Temperature-40°C – 100°C
Package / Case484-FBGA, CSPBGANumber of I/O320Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3411Number of Logic Elements/Cells43661
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationAEC-Q100Total RAM Bits2138112

Overview of XA6SLX45-3CSG484I – Spartan®-6 LX XA Field Programmable Gate Array (FPGA)

The XA6SLX45-3CSG484I is a Spartan-6 LX XA series Field Programmable Gate Array provided in a 484-pin CSPBGA package. It combines a substantial logic capacity with embedded RAM and a high pin count to address complex, space-constrained designs.

With AEC-Q100 qualification, a wide operating temperature range, and RoHS compliance, this device targets automotive and other demanding environments where qualified components and compact, flexible programmable logic are required.

Key Features

  • Core Logic — 43,661 logic elements (cells) provide the programmable fabric for implementing custom logic, control, and processing functions.
  • Embedded Memory — Approximately 2.14 Mbits of on-chip RAM to support buffering, state machines, and local data storage without external memory.
  • I/O and Integration — 320 user I/O pins to enable dense peripheral, sensor, and bus interfacing on compact PCBs.
  • Power — Narrow core supply voltage range of 1.14 V to 1.26 V for defined power-domain design and predictable device operation.
  • Package & Mounting — 484-CSPBGA (19 × 19 mm) package in 484-FBGA footprint, surface-mount compatible for high-density board layouts.
  • Reliability & Qualification — Automotive grade with AEC-Q100 qualification and an operating temperature range of −40 °C to 100 °C for use in temperature-demanding applications.
  • Environmental Compliance — RoHS compliant for regulatory and manufacturing consistency.

Typical Applications

  • Automotive control systems — Implement vehicle control logic, gateway functions, and domain controllers using AEC-Q100-qualified, temperature-rated programmable logic.
  • Sensor interfacing and signal conditioning — Use the device’s I/O density and embedded RAM for aggregating, buffering, and preprocessing sensor data.
  • Motor and powertrain control — Deploy programmable logic to implement deterministic control loops and custom timing for motor drivers and power management subsystems.
  • High-density embedded systems — Integrate custom interfaces and parallel processing in compact, surface-mount designs enabled by the 484-CSPBGA package.

Unique Advantages

  • Substantial programmable capacity: 43,661 logic elements enable complex custom logic and multi-function implementations on a single device, reducing system BOM.
  • On-chip memory for local buffering: Approximately 2.14 Mbits of embedded RAM reduces reliance on external memory and simplifies board layout.
  • High I/O count: 320 I/Os support multiple sensors, actuators, and buses without extensive external multiplexing.
  • Automotive-grade qualification: AEC-Q100 certification and −40 °C to 100 °C operating range support deployment in temperature-challenging environments.
  • Compact, manufacturable package: 484-CSPBGA (19×19) surface-mount package enables dense PCB designs while maintaining a high pin count.
  • Defined core voltage range: 1.14–1.26 V supply simplifies power-system design and helps ensure consistent device behavior.

Why Choose XA6SLX45-3CSG484I?

The XA6SLX45-3CSG484I positions itself as a compact, qualified FPGA option for designers needing a balance of logic capacity, embedded memory, and extensive I/O in a surface-mount CSPBGA package. Its AEC-Q100 qualification and extended temperature range make it suitable for automotive and other demanding applications where component qualification and reliability are required.

This device is well suited for engineering teams building scalable, robust embedded systems that benefit from on-chip memory, high I/O integration, and a known power envelope. It supports designs that prioritize board density, programmable flexibility, and long-term component availability.

Request a quote or submit a sales inquiry today to discuss availability, pricing, and technical support for XA6SLX45-3CSG484I.

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