XA6SLX45-3FGG484I

The XA6SLX45-3FGG484I is a Spartan®-6 LX field programmable gate array (FPGA) from AMD, delivered in a 484-ball BGA package. It provides a balance of programmable logic capacity, embedded memory, and a high I/O count for automotive and embedded system designs.

With AEC‑Q100 qualification, a wide operating temperature range and surface-mount packaging, this device targets designs that require automotive-grade reliability and flexible on-chip resources for custom digital functions.

Key Features

• Logic Capacity  Approximately 43,661 logic elements supported by 3,411 CLBs, enabling implementation of sizable custom logic and control functions on-chip.
• On‑chip Memory  Total embedded RAM of 2,138,112 bits — approximately 2.1 Mbits of embedded memory for buffering, FIFOs, and small data stores.
• High I/O Count  316 device I/O pins to support multiple parallel interfaces, sensor connections, and external peripherals.
• Power Supply  Core voltage range of 1.14 V to 1.26 V to match common FPGA power domains.
• Automotive Qualification  Grade: Automotive with AEC‑Q100 qualification, suitable for designs requiring that industry-standard qualification.
• Thermal and Environmental Range  Operating temperature range from −40 °C to 100 °C for extended-temperature applications.
• Package and Mounting  484‑BBGA package (supplier device package: 484‑FBGA, 23×23) in a surface-mount format for board-level integration and compact system layouts.
• Regulatory  RoHS compliant for environmental and manufacturing compliance.

Typical Applications

• Automotive Electronics  Used in vehicle systems that require qualified components and robust operating temperature support for functions such as gateway logic or domain-specific signal processing.
• Embedded Control  Custom control and signal-processing tasks in embedded platforms benefited by on-chip logic and memory resources.
• Industrial Automation  Programmable interfaces and timing-critical logic implementations that leverage the device’s high I/O count and extended temperature capability.
• Communications & I/O Bridging  Protocol bridging and custom I/O handling where a mix of logic density and numerous external connections is required.

Unique Advantages

• Automotive‑grade Qualification: AEC‑Q100 qualification provides traceable suitability for automotive applications that require that level of component qualification.
• Significant Logic Resources: Over 43,000 logic elements and 3,411 CLBs allow substantial custom logic integration, reducing the need for multiple discrete devices.
• Embedded Memory On‑Chip: Approximately 2.1 Mbits of RAM for efficient data buffering, state storage, and local algorithm acceleration without external memory.
• High Pin Count: 316 I/O pins enable complex mixed-signal and multi-interface designs without excessive external multiplexing.
• Wide Operating Range: Support for −40 °C to 100 °C and explicit core voltage range helps ensure predictable behavior across automotive and harsh environments.
• Compact Surface‑Mount Package: 484‑BBGA (484‑FBGA, 23×23) provides a high-density footprint for space-constrained PCBs.

Why Choose XA6SLX45-3FGG484I?

The XA6SLX45-3FGG484I combines the Spartan®-6 LX family’s programmable logic with automotive-grade qualification and a practical set of I/O and memory resources. It is well suited to engineers designing embedded and automotive systems that need a reliable, qualified FPGA with ample on-chip resources.

This device offers a clear balance of integration, thermal tolerance, and I/O flexibility for customers aiming to consolidate custom logic into a single, surface-mount FPGA solution backed by AMD’s Spartan‑6 lineage.

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