XA6SLX45-3FGG484Q

The XA6SLX45-3FGG484Q is a Spartan®-6 LX XA field programmable gate array from AMD, provided in a 484-ball BGA package. It combines substantial programmable logic capacity, on-chip memory, and a high I/O count to address demanding embedded and automotive electronic designs.

With AEC-Q100 qualification, RoHS compliance, and a wide operating temperature range down to −40 °C and up to 125 °C, this device is positioned for applications that require automotive-grade reliability together with flexible, high-density programmable logic.

Key Features

• Spartan-6 LX XA architecture — FPGA core in the Spartan®-6 LX XA family offering deterministic programmable logic resources for custom digital functions.
• Logic capacity — 43,661 logic elements to implement complex control, data-path, and state-machine designs.
• On-chip memory — Approximately 2.14 Mbits of embedded RAM for buffering, FIFOs, and local data storage.
• High I/O count — 316 user I/Os to support multiple parallel interfaces, signal conditioning, and board-level connectivity.
• Automotive qualification — AEC-Q100 qualification and Automotive grade designation for use in vehicle electronics environments.
• Wide operating range — Specified for −40 °C to 125 °C operation to support temperature-sensitive deployments.
• Core voltage — Core supply range 1.14 V to 1.26 V to support predictable power budgeting.
• Package and mounting — 484-ball BBGA package (supplier device package 484-FBGA, 23×23) in a surface-mount form factor for compact board integration.
• Environmental compliance — RoHS compliant for global manufacturing requirements.

Typical Applications

• Automotive control systems — Programmable logic for in-vehicle control modules where AEC-Q100 qualification and wide temperature range are required.
• Custom I/O bridging — High pin-count (316 I/Os) enables implementation of protocol bridging, sensor aggregation, and multi-interface gateways.
• Embedded buffering and packet handling — Approximately 2.14 Mbits of on-chip RAM supports temporary data storage for real-time buffering and packet processing.
• Compact system integration — 484-ball BGA surface-mount package allows dense PCBA layouts for space-constrained electronic units.

Unique Advantages

• AEC-Q100-qualified for automotive use: Enables deployment in vehicle-grade designs requiring recognized automotive qualification.
• Large programmable capacity: 43,661 logic elements provide room for complex logic, state machines, and custom accelerators without external programmable devices.
• Generous I/O resources: 316 user I/Os simplify system integration by supporting multiple parallel interfaces and peripherals directly on-chip.
• On-chip memory for local storage: Approximately 2.14 Mbits of embedded RAM reduces dependence on external memory for many buffering and data-processing tasks.
• Designed for harsh environments: −40 °C to 125 °C operating range and automotive grading support robust operation across temperature extremes.
• Compact, surface-mount packaging: 484-BBGA (484-FBGA, 23×23) enables high-density board layouts and reliable soldered mounting.

Why Choose XA6SLX45-3FGG484Q?

The XA6SLX45-3FGG484Q delivers a balanced combination of programmable logic density, embedded memory, and high I/O count within an automotive-qualified Spartan®-6 LX XA device. Its specifications—including AEC-Q100 qualification, RoHS compliance, wide temperature range, and a compact 484-ball BGA package—make it well suited to designers who need a reliable, high-capacity FPGA for automotive and other temperature-demanding embedded systems.

Engineers targeting scalable, long-lived designs will find the device’s logic capacity, on-chip RAM, and abundant I/Os useful for consolidating functions, reducing external components, and simplifying board-level integration while adhering to automotive grading and environmental standards.

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