XA6SLX45T-2CSG324Q

The XA6SLX45T-2CSG324Q is a Spartan®-6 LXT XA Field Programmable Gate Array (FPGA) from AMD. It combines a mid-range logic capacity with on-chip RAM and a high I/O count in a compact 324-pin CSPBGA surface-mount package.

Engineered for demanding temperature and qualification requirements, this device offers an automotive-grade, AEC-Q100 qualified solution with a wide operating temperature range and a low-voltage core supply, making it suitable for designs that require reliable operation across harsh environments.

Key Features

• Logic Capacity — 43,661 logic elements providing substantial programmable logic resources for complex designs; includes 3,411 configurable logic blocks (CLBs).
• Embedded Memory — Approximately 2.14 Mbits of on-chip RAM (2,138,112 total RAM bits) for buffering, frame storage and local data structures.
• I/O and Interfaces — 190 user I/Os to support multiple peripherals, sensors and interface requirements in compact systems.
• Power — Core voltage supply range of 1.14 V to 1.26 V supporting low-voltage FPGA architectures.
• Automotive Qualification — AEC-Q100 qualification and automotive grade designation for designs targeting automotive applications and environments.
• Temperature Range — Specified operating temperature from –40°C to 125°C for wide-temperature deployment.
• Package and Mounting — 324-CSPBGA (15×15) / 324-LFBGA package in a surface-mount form factor for space-efficient PCB integration.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Automotive Electronics — AEC-Q100 qualification and a –40°C to 125°C operating range support in-vehicle control, sensor aggregation and gateway functions that require automotive-grade components.
• Embedded Control Systems — High logic element count and multiple I/Os enable motor control, custom state machines and real-time control logic in compact embedded platforms.
• Signal Processing and Buffering — Approximately 2.14 Mbits of on-chip RAM combined with dense logic resources supports local buffering, preprocessing and data-path implementations.
• Connectivity and Interface Bridging — 190 I/Os accommodate protocol bridging, interface adaptation and multi-sensor connectivity in constrained board layouts.

Unique Advantages

• Automotive-ready Qualification: AEC-Q100 qualification and automotive grade designation reduce qualification overhead for automotive designs.
• Substantial Logic Resources: 43,661 logic elements (3,411 CLBs) provide capacity for sizeable custom logic, reducing the need for multiple discrete devices.
• On-chip Memory: Approximately 2.14 Mbits of embedded RAM enables local data buffering and deterministic data-path implementations without external memory.
• High I/O Count: 190 I/Os support diverse peripheral and sensor connections, simplifying system-level integration.
• Compact, Surface-Mount Package: 324-CSPBGA (15×15) / 324-LFBGA packaging offers a small footprint for space-constrained PCBs while maintaining thermal and electrical connectivity.
• Wide Operating Range: –40°C to 125°C specification supports reliable operation across harsh environmental conditions.

Why Choose XA6SLX45T-2CSG324Q?

The XA6SLX45T-2CSG324Q positions itself as a robust, mid-range FPGA offering balanced logic capacity, on-chip memory and a high I/O count in an automotive-qualified package. Its AEC-Q100 qualification, extended temperature range and compact 324-pin CSPBGA package make it well suited to engineers developing automotive and other harsh-environment embedded systems that demand reliable, low-voltage FPGA solutions.

This part is appropriate for designers who require scalable programmable logic, local memory for data handling, and extensive I/O in a surface-mount form factor while maintaining qualification for automotive applications.

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