XA6SLX45T-3FGG484Q

The XA6SLX45T-3FGG484Q is a Spartan®-6 LXT field programmable gate array (FPGA) supplied in a 484-ball BGA package. It provides a balance of configurable logic capacity, on-chip memory, and I/O density for embedded and automotive-grade applications.

With 43,661 logic elements, approximately 2.14 Mbits of embedded memory and 296 I/O, this device targets designs that require moderate logic integration, flexible I/O interfacing and operation across an extended temperature range.

Key Features

• Logic Capacity — 43,661 logic elements paired with 3,411 configurable logic blocks (CLBs) to implement custom digital functions and control logic.
• Embedded Memory — Approximately 2.14 Mbits of on-chip RAM to support buffering, temporary storage and local data processing without external memory.
• I/O Density — 296 general-purpose I/O pins to support multiple interfaces and peripheral connections directly from the device.
• Package and Mounting — Supplied in a 484-ball BGA (484-FBGA, 23×23) with surface-mount construction for compact board-level integration.
• Power — Core supply range of 1.14 V to 1.26 V to match standard FPGA core voltage domains.
• Automotive Qualification & Temperature Range — AEC-Q100 qualified and specified to operate from −40 °C to 125 °C for automotive and other high-reliability environments.
• Regulatory — RoHS compliant, supporting lead-free assembly and environmental compliance requirements.

Typical Applications

• Automotive Systems — AEC-Q100 qualification and extended temperature range make it suitable for in-vehicle logic, signal conditioning and control subsystems.
• Embedded Control — Implement real-time control, protocol bridging and custom I/O handling in compact embedded platforms.
• Signal Processing — Local buffering and on-chip memory enable preprocessing and feature extraction in sensor and data-acquisition systems.
• Interface Conversion — High I/O count supports multiple peripheral interfaces and protocol translation on a single device.

Unique Advantages

• Automotive-Grade Qualification: AEC-Q100 rating and −40 °C to 125 °C operation provide confidence for vehicle electronics and other demanding environments.
• Integrated Logic and Memory: 43,661 logic elements combined with approximately 2.14 Mbits of embedded RAM reduces dependence on external components and simplifies board design.
• High I/O Count: 296 I/O pins allow consolidation of multiple interfaces and sensors on a single FPGA, lowering BOM and connector complexity.
• Compact BGA Package: 484-ball BGA (23×23) enables a dense board footprint for space-constrained designs while supporting surface-mount assembly.
• Regulatory Compliance: RoHS compliance supports lead-free manufacturing and environmental standards adherence.

Why Choose XA6SLX45T-3FGG484Q?

The XA6SLX45T-3FGG484Q delivers a practical combination of logic capacity, embedded memory and high I/O density in an automotive-qualified FPGA package. It is positioned for designs that require reliable operation across harsh temperature ranges and benefit from integration of logic and local RAM to reduce external components.

This device is well suited to engineers developing automotive electronics, embedded controllers and interface-heavy systems who need a scalable, qualified FPGA solution with clear electrical and thermal specifications.

Request a quote or submit a pricing inquiry to evaluate the XA6SLX45T-3FGG484Q for your next design.