XA6SLX75-3CSG484Q

The XA6SLX75-3CSG484Q is a Spartan®-6 LX XA Field Programmable Gate Array (FPGA) in a 484‑FBGA (CSPBGA) package designed for applications that require programmable logic with automotive qualification. It combines a high count of logic elements, embedded memory, and a large I/O complement in a surface-mount footprint suitable for designs operating across an extended temperature range.

Key Features

• Logic Capacity — 5,831 CLBs providing 74,637 logic elements to implement complex custom logic and parallel processing architectures.
• Embedded Memory — Approximately 3.17 Mbits of on-chip RAM for data buffering, FIFOs, and local storage.
• I/O Resources — 328 I/O pins to support multiple interfaces and dense system connectivity.
• Package & Mounting — 484‑FBGA (supplier package 484‑CSPBGA, 19 × 19) in a surface-mount form factor for compact board layouts.
• Power — Core supply range of 1.14 V to 1.26 V to match regulated power domains in system designs.
• Automotive Qualification — Grade: Automotive with AEC‑Q100 qualification for applications requiring industry-recognized part qualification.
• Operating Temperature — Rated for −40 °C to 125 °C to support deployment in extended-temperature environments.
• RoHS Compliance — RoHS compliant for environmental and regulatory compatibility.

Typical Applications

• Automotive control systems — Implement custom programmable logic in electronics requiring AEC‑Q100 qualification and extended-temperature operation.
• Embedded signal processing — Use on-chip memory and large logic capacity for buffering, filtering, and parallel data handling in embedded designs.
• System interface consolidation — Leverage 328 I/O pins to integrate multiple sensors, peripherals, and interfaces into a single programmable device.
• Ruggedized and harsh-environment electronics — Deploy in systems that require surface-mount packaging combined with wide operating temperature capability.

Unique Advantages

• High logic density: 74,637 logic elements enable implementation of substantial custom logic and complex state machines without external ASICs.
• Substantial on-chip memory: Approximately 3.17 Mbits of embedded RAM reduce reliance on external memory for many buffering and local storage needs.
• Extensive I/O: 328 I/O pins provide flexibility to connect multiple interfaces and peripherals directly to the FPGA.
• Automotive-grade reliability: AEC‑Q100 qualification and −40 °C to 125 °C operating range support use in demanding automotive and extended-temperature applications.
• Compact, manufacturable package: 484‑CSPBGA (19 × 19) surface-mount package balances board area and assembly compatibility for volume production.
• Controlled core voltage: 1.14–1.26 V supply range facilitates integration with regulated power architectures.

Why Choose XA6SLX75-3CSG484Q?

The XA6SLX75-3CSG484Q positions itself as a robust programmable-logic option for designs that need significant logic resources, embedded memory, and extensive I/O in an automotive-qualified package. Its combination of CLB density, memory, and AEC‑Q100 qualification makes it suitable for engineers targeting programmable solutions in extended-temperature and vehicle-focused environments.

This FPGA is well suited to teams needing scalability and on-device integration to reduce board-level complexity while maintaining the reliability and environmental performance demanded by automotive and other harsh-environment applications.

Request a quote or submit an inquiry to get pricing, lead time, and availability for the XA6SLX75-3CSG484Q. Our team can assist with part sourcing and technical details specific to your design needs.