XA6SLX75T-3FGG484Q

The XA6SLX75T-3FGG484Q is a Spartan®-6 LXT XA Field Programmable Gate Array (FPGA) IC from AMD. It delivers a combination of high logic density, embedded memory, and substantial I/O capacity in a compact 484-ball BGA package for embedded and automotive applications.

With AEC‑Q100 qualification and an extended operating temperature range, this device is designed for environments that require automotive-grade reliability. Key attributes include approximately 74,637 logic elements, roughly 3.17 Mbits of on-chip RAM, and 268 I/O pins, all operating from a 1.14 V to 1.26 V supply.

Key Features

• Core Architecture Spartan®-6 LXT XA Field Programmable Gate Array IC designed for configurable digital logic implementation.
• Logic Capacity Approximately 74,637 logic elements to support complex, logic‑intensive designs.
• Embedded Memory Approximately 3.17 Mbits of on-chip RAM for packet buffering, lookup tables, and local data storage.
• I/O Density 268 general-purpose I/O pins to accommodate multiple peripherals, interfaces, and external devices.
• Package and Mounting 484-ball BGA package (supplier package: 484-FBGA, 23×23) with surface‑mount attachment for space-efficient board integration.
• Power Core supply range from 1.14 V to 1.26 V to meet precise power-domain requirements.
• Automotive Qualification and Temperature Range AEC‑Q100 qualified and specified for operation from -40 °C to 125 °C for automotive and harsh-environment use.
• Regulatory Compliance RoHS compliant for adherence to environmental and material standards.

Typical Applications

• Automotive Electronics — AEC‑Q100 qualification and extended temperature operation make this FPGA suitable for vehicle systems that require component-level automotive validation.
• Embedded Control and Signal Processing — High logic element count and on-chip memory support algorithm implementation and real-time processing tasks.
• Multi‑interface Gateway and Bridging — Large I/O count enables complex connectivity and interface translation between multiple subsystems.

Unique Advantages

• AEC‑Q100 Qualified for Automotive Use: Explicit qualification and automotive grade designation support deployment in vehicle electronics and other demanding environments.
• High Logic and Memory Density: Approximately 74,637 logic elements and ~3.17 Mbits of embedded RAM allow consolidation of functions that would otherwise require additional components.
• Extensive I/O Capacity: 268 I/O pins provide flexibility for interfacing with sensors, actuators, and external peripherals without immediate need for I/O expanders.
• Compact BGA Package: 484-ball FBGA (23×23) package enables a high‑pin, high‑density implementation while minimizing PCB footprint.
• Wide Operating Range and Low-Voltage Core: Support for 1.14 V to 1.26 V core supply and -40 °C to 125 °C operation addresses power-constrained and temperature-demanding designs.
• RoHS Compliant: Meets common environmental directives for restriction of hazardous substances.

Why Choose XA6SLX75T-3FGG484Q?

The XA6SLX75T-3FGG484Q positions itself as a durable, high-density FPGA option for teams designing automotive and harsh-environment systems. Its combination of approximately 74,637 logic elements, around 3.17 Mbits of embedded memory, 268 I/O, and AEC‑Q100 qualification provides a clear technical basis for integrating complex logic and interface functions into a single device.

Manufactured by AMD and delivered in a compact 484-ball FBGA package with surface-mount mounting, this FPGA is suitable for designs that require a balance of integration, I/O capability, and automotive-grade reliability while operating within a tightly defined core-voltage window.

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