XA6SLX9-2CSG225I

The XA6SLX9-2CSG225I is a Spartan®-6 LX field programmable gate array (FPGA) from AMD. It provides a mid-range logic fabric with 9,152 logic elements and approximately 0.59 Mbits of embedded memory, together with 160 user I/O pins for flexible system interfacing.

Designed as a surface-mount device in a 225-CSPBGA (13 × 13) / 225-LFBGA package, this device operates from 1.14 V to 1.26 V and is qualified to AEC-Q100 for automotive applications, with an operating temperature range of −40 °C to 100 °C.

Key Features

• Core Logic 9,152 logic elements provide mid-range programmable logic capacity for custom digital functions.
• Embedded Memory Approximately 0.59 Mbits of on-chip RAM to support buffers, FIFOs and small data stores without external memory.
• I/O Connectivity 160 user I/O pins offering flexible interfacing options for external peripherals and sensors.
• Power Operates from a supply voltage range of 1.14 V to 1.26 V to match system power requirements.
• Package & Mounting 225-CSPBGA (13 × 13) / 225-LFBGA package in a surface-mount form factor for compact, board-level integration.
• Temperature & Qualification Automotive grade with AEC-Q100 qualification and an operating temperature range of −40 °C to 100 °C for demanding environments.
• Regulatory RoHS compliant.

Typical Applications

• Automotive Systems AEC-Q100 qualification and wide operating temperature support deployment in automotive electronic subsystems that require qualified components.
• Embedded Control and Custom Logic Mid-range logic capacity and on-chip RAM enable implementation of custom control functions, protocol handling, and real-time logic processing.
• Compact Board-Level Integration 225-CSPBGA package and surface-mount mounting support high-density PCB designs where board space is constrained.

Unique Advantages

• AEC-Q100 Qualified: Provides a component-level qualification suitable for automotive applications that require AEC-Q100-rated devices.
• Mid-Range Logic Capacity: 9,152 logic elements allow implementation of substantial custom logic without moving to larger device families, simplifying design choices.
• On-Chip Memory: Approximately 0.59 Mbits of embedded RAM reduce the need for some external memory, lowering BOM complexity.
• Generous I/O Count: 160 user I/Os support multiple peripheral interfaces and sensor connections directly at the FPGA.
• Compact BGA Package: 225-CSPBGA (13 × 13) package enables dense, space-efficient board layouts while maintaining a high pin count.
• Wide Operating Range: −40 °C to 100 °C operation and a defined supply voltage window support deployment in temperature-variable environments.

Why Choose XA6SLX9-2CSG225I?

The XA6SLX9-2CSG225I balances mid-range programmable logic capacity, embedded memory, and a substantial I/O complement in a compact, surface-mount BGA package. Its AEC-Q100 qualification and extended temperature range make it appropriate for designs that require automotive-grade components alongside flexible FPGA programmability.

Manufactured by AMD, this device suits designers seeking a reliable, board-friendly FPGA option for embedded systems and automotive electronic subsystems that demand defined electrical and environmental performance.

Request a quote or submit a pricing inquiry today to check availability and obtain ordering information for the XA6SLX9-2CSG225I.