XA6SLX9-2CSG324I

The XA6SLX9-2CSG324I is a Spartan®-6 LX XA field programmable gate array (FPGA) IC from AMD. It provides reconfigurable logic resources and on-chip memory in a compact 324‑CSPBGA (15×15) surface-mount package.

With 9,152 logic elements, approximately 0.59 Mbits of embedded memory and 200 I/O pins, this device is positioned for designs that require a balance of integration, configurability and automotive-grade reliability.

Key Features

• Logic Capacity  Offers 9,152 logic elements organized across 715 configurable logic blocks (CLBs) for implementing custom digital functions.
• Embedded Memory  Approximately 0.59 Mbits of on-chip RAM to support buffering, state storage and memory-intensive logic.
• I/O Count  200 user I/Os to connect to peripherals, sensors and external devices directly from the FPGA.
• Power  Core supply operating range of 1.14 V to 1.26 V for predictable power planning and integration with regulated power rails.
• Package & Mounting  324‑CSPBGA (15×15) package in a surface-mount form factor for space-efficient board implementation.
• Automotive Qualification  Grade: Automotive with AEC‑Q100 qualification, supporting deployment in automotive electronics contexts.
• Operating Range  Rated for operation from -40°C to 100°C to accommodate extended temperature environments.
• Environmental Compliance  RoHS compliant for adherence to lead-free manufacturing requirements.

Unique Advantages

• Balanced integration: Combines 9,152 logic elements and approximately 0.59 Mbits of embedded memory in a single FPGA, reducing component count and PCB complexity.
• High I/O density: 200 I/Os provide flexibility to interface with multiple sensors, buses and peripherals without additional I/O expanders.
• Automotive-grade qualification: AEC‑Q100 qualification and automotive grade designation support use in vehicle electronics and other demanding applications.
• Compact, manufacturable package: 324‑CSPBGA (15×15) surface-mount package enables high-density board layouts and standard assembly processes.
• Robust operating envelope: Wide temperature range (-40°C to 100°C) and defined core voltage range simplify system-level thermal and power design.
• Regulatory compliance: RoHS compliance helps streamline environmental and manufacturing approvals.

Why Choose XA6SLX9-2CSG324I?

The XA6SLX9-2CSG324I offers a practical combination of logic capacity, embedded memory and I/O density in an automotive-qualified FPGA package. Its defined core voltage range and extended temperature rating make it suitable for engineered systems where predictable electrical and thermal performance are required.

This device is well suited for designers seeking a compact, reconfigurable solution with automotive-grade qualification, enabling scalable designs that benefit from on-chip memory and substantial I/O count while maintaining compliance with RoHS standards.

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