XA6SLX9-2FTG256Q

The XA6SLX9-2FTG256Q is a Spartan®-6 LX series field programmable gate array (FPGA) provided in a 256-LBGA package. It delivers 9,152 logic elements, approximately 0.59 Mbits of embedded memory, and up to 186 user I/O pins in a surface-mount footprint.

With a 1.14 V–1.26 V core supply range, AEC-Q100 qualification and an operating temperature range of −40 °C to 125 °C, this device targets applications that require programmable logic, dense I/O and robust environmental tolerance.

Key Features

• Core Logic — 9,152 logic elements for implementing custom digital logic, state machines and control functions.
• Embedded Memory — Approximately 0.59 Mbits of on-chip RAM to support buffering, FIFOs and local data storage.
• I/O Capacity — 186 user I/Os to support multiple interfaces and parallel connections in a single device.
• Automotive Qualification — AEC-Q100 qualification and listed as Automotive grade, suitable for designs requiring that level of qualification.
• Power and Temperature — Core voltage range of 1.14 V to 1.26 V and an operating temperature range of −40 °C to 125 °C for wide thermal tolerance.
• Package and Mounting — 256-LBGA (256-FTBGA, 17×17) surface-mount package for compact board-level integration.
• Regulatory — RoHS compliant for environmental compliance in manufacturing.

Typical Applications

• Automotive control and sensor processing — AEC-Q100 qualification and −40 °C to 125 °C rating make the device suitable for vehicle electronics requiring programmable logic and moderate embedded memory.
• Embedded I/O and interface bridging — High I/O count (186 pins) supports protocol translation, parallel interface aggregation and custom peripheral control.
• Deterministic control systems — 9,152 logic elements and on-chip memory enable implementation of real-time control logic and local buffering for embedded controllers.

Unique Advantages

• Qualified for automotive use — AEC-Q100 qualification provides an established level of component qualification for vehicle-grade electronics.
• Balanced integration — Combines a substantial number of logic elements with embedded RAM and high I/O count to consolidate multiple functions into a single device and reduce BOM count.
• Wide thermal range — −40 °C to 125 °C operating range supports deployment in thermally demanding environments.
• Compact board-level package — 256-LBGA surface-mount package offers a small footprint for space-constrained boards while providing plentiful I/O.
• RoHS compliance — Supports environmentally conscious manufacturing and regulatory requirements.

Why Choose XA6SLX9-2FTG256Q?

The XA6SLX9-2FTG256Q delivers a practical combination of programmable logic capacity, embedded memory, and abundant I/O in a compact 256-LBGA package. Its AEC-Q100 qualification and extended temperature rating make it suitable for designs that require qualified components and broad environmental tolerance.

This device is well suited for engineers and procurement teams looking to integrate flexible logic, interface consolidation and on-chip buffering into applications that demand robust qualification and board-level density.

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