XA7A100T-1CSG324Q

IC FPGA 210 I/O 324CSBGA
Part Description

Artix-7 XA Field Programmable Gate Array (FPGA) IC 210 4976640 101440 324-LFBGA, CSPBGA

Quantity 748 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package324-CSPBGA (15x15)GradeAutomotiveOperating Temperature-40°C – 125°C
Package / Case324-LFBGA, CSPBGANumber of I/O210Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs7925Number of Logic Elements/Cells101440
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationAEC-Q100Total RAM Bits4976640

Overview of XA7A100T-1CSG324Q – Artix-7 XA Field Programmable Gate Array (FPGA), 324-LFBGA

The XA7A100T-1CSG324Q is an Artix-7 XA field programmable gate array (FPGA) IC from AMD, offering a mid-to-high density programmable fabric with substantial on-chip memory and I/O capability. It is supplied in a compact 324-pin CSPBGA package and is specified for automotive use with AEC-Q100 qualification and a wide operating temperature range.

Key Features

  • Logic Capacity  Provides 101,440 logic elements for custom digital logic, state machines, and programmable datapaths.
  • Embedded Memory  Includes approximately 4.98 Mbits of on-chip RAM to support buffering, lookup tables, and local storage.
  • I/O Resources  210 user I/O pins enable connectivity to peripherals, sensors, and external memory interfaces.
  • Power and Core Voltage  Core supply range is 0.95–1.05 V, allowing designers to align power delivery with platform requirements.
  • Automotive Qualification  Rated Automotive grade with AEC-Q100 qualification for use in automotive applications requiring that certification.
  • Operating Range  Specified for operation from −40 °C to 125 °C to meet wide-temperature application demands.
  • Package and Mounting  324-LFBGA (324-CSPBGA, 15×15) package in a surface-mount form factor for compact PCB layouts.
  • Environmental Compliance  RoHS-compliant to meet common environmental and manufacturing requirements.

Typical Applications

  • Automotive Systems  AEC-Q100 qualification and −40 °C to 125 °C range make this device suitable for in-vehicle control, sensor aggregation, and processing tasks that require automotive-grade components.
  • Embedded Processing  High logic density and several megabits of embedded RAM enable implementing custom accelerators, protocol handling, and deterministic control logic.
  • Connectivity and I/O Expansion  With 210 I/O pins, the device can serve as an interface hub for multiple peripherals, sensors, and external devices in compact designs.

Unique Advantages

  • High Logic Density: 101,440 logic elements provide the capacity to implement complex logic and multiple concurrent functions on a single device.
  • Significant On‑Chip Memory: Approximately 4.98 Mbits of embedded RAM reduces dependence on external memory for buffering and local storage.
  • Automotive-Grade Qualification: AEC-Q100 qualification and wide temperature range support deployment in vehicle-level applications that require that certification.
  • Robust I/O Count: 210 I/O pins enable rich peripheral connectivity and flexible board-level interfacing without additional bridge components.
  • Compact, Surface-Mount Package: The 324-CSPBGA (15×15) package provides a small footprint for space-constrained PCB designs.
  • Low-Voltage Core: 0.95–1.05 V supply range supports efficient core power delivery and integration with platform power rails.

Why Choose XA7A100T-1CSG324Q?

The XA7A100T-1CSG324Q balances high logic capacity, substantial embedded memory, and a large I/O complement in a compact automotive-qualified package. Its AEC-Q100 qualification and extended temperature rating position it for designs that require both programmable flexibility and the environmental robustness demanded by automotive applications.

This FPGA is suited to engineering teams building systems that need on-chip logic and memory density, broad connectivity, and a qualified component foundation—delivering scalable, reliable integration while maintaining a compact PCB footprint.

Request a quote or submit a procurement inquiry to get pricing and availability for the XA7A100T-1CSG324Q.

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