XA7A100T-1FGG484Q
| Part Description |
Artix-7 XA Field Programmable Gate Array (FPGA) IC 285 4976640 101440 484-BBGA |
|---|---|
| Quantity | 1,208 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Automotive | Operating Temperature | -40°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 285 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 7925 | Number of Logic Elements/Cells | 101440 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | AEC-Q100 | Total RAM Bits | 4976640 |
Overview of XA7A100T-1FGG484Q – Artix-7 XA Field Programmable Gate Array, 101,440 logic elements, 285 I/O, 484-BBGA
The XA7A100T-1FGG484Q is an Artix-7 XA Field Programmable Gate Array (FPGA) offered in a 484-ball BGA package. It provides high logic density and abundant I/O, combined with on-chip memory and wide operating conditions tailored for demanding embedded and automotive applications.
With 101,440 logic elements and approximately 4.98 Mbits of embedded RAM, this device targets designs that require significant programmable logic, sizable local memory, and robust I/O connectivity while meeting automotive AEC-Q100 qualification.
Key Features
- Logic Capacity 101,440 logic elements suitable for complex programmable logic implementations and multi-function designs.
- Embedded Memory Approximately 4.98 Mbits of on-chip RAM for buffering, state storage, and mid-sized data working sets.
- I/O Resources 285 I/O pins to support extensive sensor, actuator, and peripheral interfacing without external multiplexing.
- Power Supply Core supply range of 0.95–1.05 V, enabling controlled power provisioning and integration into regulated power domains.
- Package and Mounting 484-ball BGA packaging (supplier device package: 484-FBGA, 23 × 23) in a surface-mount form factor for compact board-level integration.
- Automotive Qualification & Temperature AEC-Q100 qualified and specified to operate from -40 °C to 125 °C, supporting automotive-grade environments.
- Compliance RoHS compliant for regulatory and assembly process compatibility.
Typical Applications
- Automotive Control Systems Suitable for vehicle electronic control units and sensor processing where AEC-Q100 qualification and extended temperature range are required.
- High-Density I/O Interfaces Ideal for bridging and aggregating multiple sensors, actuators, and communication channels thanks to 285 I/O pins.
- Embedded Signal Processing On-chip memory and large logic capacity enable local buffering and real-time logic processing for embedded functions.
- Compact Board Designs 484-BGA surface-mount package supports space-constrained PCBs while providing substantial programmable resources.
Unique Advantages
- Significant Logic Density: 101,440 logic elements provide headroom for complex custom logic without immediate need for multiple devices.
- Integrated Memory: Approximately 4.98 Mbits of on-chip RAM reduces reliance on external memory for many buffering and stateful tasks.
- Extensive I/O Count: 285 I/O pins simplify board-level connectivity and reduce external multiplexing or expansion requirements.
- Automotive-Grade Qualification: AEC-Q100 qualification and a -40 °C to 125 °C operating range support deployment in automotive environments.
- Compact, Surface-Mount Package: 484-BBGA (484-FBGA, 23 × 23) enables high-density PCB layouts and reliable soldered assembly.
- RoHS Compliant: Meets common lead-free assembly and environmental compliance requirements.
Why Choose XA7A100T-1FGG484Q?
The XA7A100T-1FGG484Q combines substantial programmable logic capacity, embedded RAM, and a high I/O count in a compact 484-ball BGA package, making it well suited for embedded and automotive applications that require both integration and reliability. Its AEC-Q100 qualification and extended temperature rating provide assurance for deployment in thermally and electrically demanding environments.
This device is a strong option for designers seeking a single-chip solution that balances logic density, local memory, and I/O connectivity while maintaining automotive-grade qualification and RoHS compliance.
Request a quote or submit an inquiry to receive pricing, availability, and additional procurement details for the XA7A100T-1FGG484Q.

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