XA7A100T-2CSG324I

The XA7A100T-2CSG324I is an Artix-7 XA field programmable gate array (FPGA) supplied in a 324‑LFBGA/CSPBGA package. It delivers a high logic capacity and on-chip memory combined with automotive-grade qualification for temperature and reliability in demanding embedded systems.

With 101,440 logic elements, approximately 4.98 Mbits of embedded memory and 210 I/O, this device is suited to applications that require dense programmable logic, significant internal RAM, and a robust qualification profile including AEC‑Q100 and RoHS compliance.

Key Features

• Core Logic  101,440 logic elements provide large-capacity programmable fabric for custom logic, state machines and algorithm acceleration.
• Embedded Memory  Approximately 4.98 Mbits of on-chip RAM for buffering, lookup tables and data staging without external memory.
• I/O Count  210 programmable I/O pins to support sensor interfaces, control signals and board-level connectivity.
• Power Supply  Specified core voltage range of 0.95 V to 1.05 V for the device core supply.
• Package & Mounting  324‑LFBGA (324‑CSPBGA, 15×15) package in a surface-mount form factor for compact, high-density PCB integration.
• Automotive Qualification & Temperature Range  AEC‑Q100 qualified with an operating temperature range from −40 °C to 100 °C, supporting automotive system requirements.
• Regulatory  RoHS compliant.

Typical Applications

• Automotive Control Systems  AEC‑Q100 qualification and −40 °C to 100 °C operating range make this FPGA suitable for in-vehicle control, signal conditioning and domain controller functions requiring robust temperature tolerance.
• High‑Density Signal Processing  The combination of 101,440 logic elements and approximately 4.98 Mbits of embedded memory supports on-chip acceleration of compute- and memory-intensive signal processing tasks.
• I/O‑Intensive Interfaces  With 210 I/O pins and a compact 324‑LFBGA package, the device is well suited for applications that require numerous external connections in space-constrained PCB layouts.
• Embedded Custom Logic  Flexible programmable fabric enables implementation of custom control, protocol bridging or specialized hardware functions without adding discrete ASICs.

Unique Advantages

• High logic capacity: 101,440 logic elements allow large-scale custom logic implementations on a single device, reducing system complexity.
• Substantial on‑chip memory: Approximately 4.98 Mbits of embedded RAM reduces dependence on external memory for buffering and LUTs, simplifying board design.
• Automotive‑ready qualification: AEC‑Q100 qualification and extended temperature range support deployment in automotive environments that demand reliability.
• Compact, board‑friendly package: 324‑CSPBGA (15×15) surface-mount package balances I/O density and a small PCB footprint for space-constrained systems.
• Controlled core power envelope: Core supply specified between 0.95 V and 1.05 V enables predictable power budgeting and system-level power design.
• RoHS compliant: Meets common environmental requirements for commercial and automotive production.

Why Choose XA7A100T-2CSG324I?

The XA7A100T-2CSG324I positions itself as a high-capacity, automotive‑qualified FPGA option for engineers who need significant on-chip logic and memory in a compact package. Its combination of 101,440 logic elements, roughly 4.98 Mbits of embedded RAM and 210 I/O provides the building blocks for complex, I/O-heavy designs while simplifying board-level memory and connectivity requirements.

Designed with AEC‑Q100 qualification and an extended −40 °C to 100 °C operating range, this device delivers a balance of performance, integration and reliability for automotive and other temperature‑demanding embedded systems, offering long-term design scalability within a single FPGA family.

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