XA7A100T-1CSG324I

The XA7A100T-1CSG324I is an Artix-7 XA Field Programmable Gate Array (FPGA) IC from AMD, supplied in a 324-LFBGA (CSPBGA) package. This device offers a high logic capacity and substantial on-chip memory in a compact surface-mount package, and is qualified to AEC-Q100 for automotive use.

Designed for applications requiring programmable logic with robust temperature and power characteristics, the part provides a combination of logic density, embedded memory and I/O count suitable for demanding electronic systems.

Key Features

• Logic Capacity — 101,440 logic elements to implement complex digital functions and custom logic architectures.
• Embedded Memory — Approximately 4.98 Mbits of on-chip RAM for buffering, state storage and data manipulation without external memory.
• I/O Count — 210 user I/O pins to support extensive signal interfacing and peripheral connectivity.
• Power Supply — Core voltage range of 0.95 V to 1.05 V, enabling defined power integration and design margining.
• Package & Mounting — 324-LFBGA (324-CSPBGA, 15×15) in a surface-mount form factor for dense board-level integration.
• Automotive Qualification — AEC-Q100 qualification and Automotive grade designation for use in vehicle electronics projects.
• Operating Temperature — Rated for −40°C to 100°C ambient operation to meet wide temperature requirements.
• Environmental Compliance — RoHS compliant for environmentally conscious design and manufacturing.

Typical Applications

• Automotive Electronics — AEC-Q100 qualification and Automotive grade make the device suitable for programmable logic in vehicle systems where qualified components are required.
• High-density I/O Designs — 210 I/O pins and a compact 324-LFBGA package support complex signal routing in space-constrained assemblies.
• Memory-intensive Logic — Approximately 4.98 Mbits of embedded RAM provides on-chip storage for buffering and real-time data handling.

Unique Advantages

• Automotive-qualified silicon: AEC-Q100 qualification and Automotive grade support integration into vehicle electronics that require qualified components.
• High logic density: 101,440 logic elements accommodate large or multiple concurrent logic functions on a single device, reducing the need for additional programmable devices.
• Significant on-chip memory: Nearly 5 Mbits of embedded RAM reduces dependency on external memory for many buffering and state-storage tasks.
• Compact, serviceable package: 324-LFBGA (324-CSPBGA, 15×15) and surface-mount construction enable dense PCB layouts while preserving routing and assembly workflows.
• Wide operating range: Core supply and ambient temperature specifications provide predictable behavior across typical automotive thermal and power conditions.
• RoHS compliant: Aligns with environmental and manufacturing requirements for modern electronic products.

Why Choose XA7A100T-1CSG324I?

The XA7A100T-1CSG324I delivers a balance of logic capacity, embedded memory and I/O resources in a compact, automotive-qualified package from AMD. Its combination of 101,440 logic elements, approximately 4.98 Mbits of on-chip RAM and 210 I/O make it well suited for designs that require substantial programmable logic and on-chip storage within constrained board space.

With AEC-Q100 qualification, a defined core voltage range and an operating temperature span of −40°C to 100°C, this FPGA targets designs where qualification, thermal robustness and predictable power characteristics matter over the product lifecycle.

Request a quote or submit an inquiry for pricing and availability of the XA7A100T-1CSG324I to evaluate it for your next automotive or high-density programmable logic design.