XA6SLX9-2CSG324Q

The XA6SLX9-2CSG324Q is a Spartan®-6 LX field programmable gate array (FPGA) from AMD. It delivers a balanced combination of programmable logic, embedded memory, and I/O density in a compact 324‑LFBGA/CSPBGA package for applications requiring temperature and qualification robustness.

This device is targeted at designs that require up to 9,152 logic elements, approximately 0.59 Mbits of on‑chip RAM, and up to 200 I/O pins, with AEC‑Q100 qualification and an extended operating temperature range for automotive deployments.

Key Features

• Logic Capacity — 9,152 logic elements provide the programmable fabric for implementing custom digital functions and control logic.
• Embedded Memory — Approximately 0.59 Mbits of on‑chip RAM for buffering, packet storage, and state machines.
• I/O Density — Up to 200 user I/O pins to support multiple parallel interfaces and peripheral connections.
• Power — Nominal core supply range of 1.14 V to 1.26 V to match system power rails and design constraints.
• Package & Mounting — 324‑LFBGA / CSPBGA package (supplier package: 324‑CSPBGA, 15 × 15 mm) in a surface‑mount form factor for space‑constrained boards.
• Automotive Qualification & Temperature Range — Automotive grade with AEC‑Q100 qualification and an operating temperature range of −40°C to 125°C for deployment in demanding environments.
• RoHS Compliance — Environmentally compliant with RoHS requirements.

Typical Applications

• Automotive Control Systems — Implement vehicle control logic, signal conditioning, and interface bridging where AEC‑Q100 qualification and wide temperature range are required.
• Sensor and Actuator Interfaces — Aggregate, process, and route sensor data with available I/O and on‑chip RAM for buffering and preprocessing.
• Embedded Prototyping and Custom Logic — Rapid development of custom digital blocks and state machines using the programmable logic resources.
• Communication and I/O Aggregation — Consolidate multiple serial/parallel interfaces and perform protocol adaptation using available I/O pins and logic elements.

Unique Advantages

• Automotive‑grade qualification: AEC‑Q100 qualification and −40°C to 125°C operation provide confidence for automotive deployments.
• Compact, high‑density package: 324‑CSPBGA (15×15 mm) enables high functionality in space‑constrained designs.
• Balanced integration: Combination of 9,152 logic elements, on‑chip RAM, and 200 I/Os reduces the need for external glue logic and memory in many designs.
• Controlled core power envelope: Defined supply range (1.14 V–1.26 V) helps simplify power‑tree planning and voltage regulator selection.
• RoHS compliant: Meets environmental compliance requirements for modern product designs.

Why Choose XA6SLX9-2CSG324Q?

The XA6SLX9-2CSG324Q positions itself as a reliable, automotive‑qualified FPGA option that balances programmable logic capacity, embedded memory, and substantial I/O in a small footprint. Its AEC‑Q100 qualification and extended temperature range make it a practical choice for automotive and other temperature‑sensitive applications that demand verified component reliability.

This device is well suited for engineers and teams seeking moderate logic density and flexible I/O in a compact package from a recognized manufacturer, enabling scalable designs that combine integration with qualification for long‑life deployments.

Request a quote or contact sales to discuss availability, pricing, and how the XA6SLX9-2CSG324Q can fit your next design.