XA6SLX9-2CSG225Q

The XA6SLX9-2CSG225Q is a Spartan®-6 LX XA field programmable gate array (FPGA) in a compact 225-CSPBGA package. It provides reconfigurable logic resources and on-chip memory suitable for designs that require flexible, programmable digital logic.

Key device attributes include 9,152 logic elements, approximately 0.59 Mbits of embedded memory, 160 user I/Os, AEC-Q100 qualification for automotive use, a surface-mount 225-CSPBGA (13×13) package, and an operating range from −40°C to 125°C with a core supply of 1.14 V to 1.26 V.

Key Features

• Core Logic  Provides 9,152 logic elements to implement custom digital functions and finite state machines.
• Embedded Memory  Approximately 0.59 Mbits of on-chip RAM for buffering, small lookup tables, and state storage.
• I/O Resources  160 user I/Os to support multiple peripheral interfaces and external device connections.
• Power  Core voltage supply range of 1.14 V to 1.26 V for the device core domain.
• Package & Mounting  225-CSPBGA (13×13) 225-LFBGA package designed for surface-mount assembly in compact form factors.
• Automotive Qualification & Temperature Range  AEC-Q100 qualified and rated for operation from −40°C to 125°C for automotive environments.
• Regulatory Compliance  RoHS compliant.

Typical Applications

• Automotive electronic systems  AEC-Q100 qualification and −40°C to 125°C operation make the device suitable for automotive control and monitoring functions that require reconfigurable logic.
• Embedded reprogrammable logic  Use the FPGA’s 9,152 logic elements and 160 I/Os for custom protocol handling, glue logic, and in-system configurability.
• Space-constrained designs  The 225-CSPBGA surface-mount package provides a compact footprint for applications that need a small, high-density programmable device.

Unique Advantages

• Automotive-qualified reliability: AEC-Q100 qualification combined with a −40°C to 125°C operating range supports deployment in automotive applications.
• Significant configurable logic: 9,152 logic elements enable implementation of complex control and interfacing logic without external ASICs.
• On-chip memory for buffering: Approximately 0.59 Mbits of embedded RAM reduces the need for some external memory in buffering and small data storage tasks.
• Flexible I/O count: 160 user I/Os accommodate multiple interfaces and expandability within a single device.
• Compact, assembly-friendly package: 225-CSPBGA (13×13) surface-mount package supports high-density PCBs and streamlined assembly processes.
• Controlled core power domain: Narrow core voltage range (1.14 V to 1.26 V) facilitates predictable power planning for the device core.

Why Choose XA6SLX9-2CSG225Q?

The XA6SLX9-2CSG225Q positions itself as a reconfigurable logic option for designers who require automotive qualification, a compact package, and a balanced mix of logic, memory, and I/O density. Its AEC-Q100 status and extended temperature rating support designs intended for demanding operating environments.

This device is well suited to projects that need in-field programmability, a moderate number of logic resources (9,152 logic elements), and a substantial I/O count (160), all in a small 225-CSPBGA surface-mount package—delivering a scalable, robust building block for embedded and automotive-focused designs.

Request a quote or contact sales to discuss availability, pricing, and how XA6SLX9-2CSG225Q can fit your next design.