XA6SLX75T-2FGG484Q

The XA6SLX75T-2FGG484Q is a Spartan®-6 LXT XA field programmable gate array (FPGA) manufactured by AMD. It provides a large programmable fabric with significant embedded memory and a high I/O count in a compact surface-mount ball grid array package.

Targeted for designs that require substantial on-chip logic and memory capacity along with automotive-grade qualification, this device combines a wide operating temperature range and a tightly specified core voltage for reliable operation in demanding environments.

Key Features

• Programmable Logic  Approximately 74,637 logic elements available for implementing custom digital functions and control logic.
• Embedded Memory  Approximately 3.17 Mbits of on-chip RAM for buffering, state storage, and local data processing without external memory.
• I/O Capacity  268 user I/O pins to support extensive peripheral and interface connectivity.
• Power  Core voltage supply range specified at 1.14 V to 1.26 V for consistent power design and supply selection.
• Package & Mounting  484-BBGA package (supplier device package: 484-FBGA, 23×23) designed for surface-mount assembly.
• Automotive Qualification & Temperature  AEC‑Q100 qualification and automotive grade rating with an operating temperature range of −40 °C to 125 °C for harsh-environment deployment.
• RoHS Compliance  Device is RoHS compliant for environmental and manufacturing requirements.

Typical Applications

• Automotive Systems  Suitable for automotive electronic designs where AEC‑Q100 qualification and −40 °C to 125 °C operation are required.
• High‑Density I/O Designs  Deployments that require broad peripheral interfacing or numerous signal connections can take advantage of 268 I/Os.
• Complex Logic and On‑Chip Memory  Implementations needing significant programmable logic together with approximately 3.17 Mbits of embedded RAM for local buffering and control.

Unique Advantages

• Automotive‑grade qualification: AEC‑Q100 qualification and automotive grade classification support use in automotive electronics and related applications.
• Large programmable fabric: 74,637 logic elements enable integration of substantial custom logic functions within a single device.
• Significant on‑chip memory: Approximately 3.17 Mbits of embedded RAM reduces dependence on external memory and simplifies board-level design.
• Extensive I/O: 268 I/Os provide flexibility for sensor, actuator, and peripheral interfacing without additional bridge devices.
• Wide operating range: Operation from −40 °C to 125 °C accommodates harsh-environment requirements.
• Compact surface‑mount package: 484-BBGA (484-FBGA, 23×23) format supports high-density PCB layouts and automated assembly.

Why Choose XA6SLX75T-2FGG484Q?

The XA6SLX75T-2FGG484Q positions itself as a high-capacity, automotive-qualified FPGA option for systems that require substantial programmable logic, embedded memory, and broad I/O in a compact surface-mount package. Its AEC‑Q100 qualification and wide temperature range make it a suitable choice for demanding environments where reliability and stability are priorities.

Designed and manufactured by AMD, this device is appropriate for design teams seeking integrated logic and memory capacity with automotive-grade qualification, helping reduce board-level complexity while maintaining defined electrical and thermal limits.

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