XA6SLX75-3FGG484Q

The XA6SLX75-3FGG484Q is a Spartan®-6 LX field programmable gate array (FPGA) in a 484‑BBGA package offering a balance of logic capacity, embedded memory, and I/O for embedded systems. It is supplied as an AEC‑Q100 qualified automotive-grade device with a wide operating temperature range and RoHS compliance, making it suitable for applications requiring extended environmental robustness.

Key on-chip resources include 74,637 logic elements, approximately 3.17 Mbits of embedded memory, and 280 I/O pins, providing designers with integration options for control, signal processing and interface-centric designs while operating from a 1.14 V to 1.26 V core supply.

Key Features

• Logic Capacity  Offers 74,637 logic elements to implement complex digital functions and custom logic for embedded designs.
• Embedded Memory  Approximately 3.17 Mbits of on-chip RAM to support buffering, state storage and small data-processing tasks without external memory.
• I/O Resources  280 I/O pins provide flexible connectivity for interfaces, sensors and peripherals in space-constrained designs.
• Package and Mounting  Supplied in a 484‑BBGA (supplier package: 484‑FBGA, 23×23) surface-mount package for compact board-level integration.
• Power  Core voltage range specified at 1.14 V to 1.26 V to match system power-rail requirements.
• Automotive Qualification  AEC‑Q100 qualification and an automotive grade designation to meet reliability needs in vehicle electronics.
• Temperature Range  Rated for operation from -40 °C to 125 °C for use in demanding thermal environments.
• Environmental Compliance  RoHS compliant to support regulatory and manufacturing requirements.

Typical Applications

• Automotive Electronics  Engine control modules, body control or sensor aggregation where AEC‑Q100 qualification and wide temperature range are required.
• Industrial Control  Control logic and real-time interfacing in factory automation equipment that benefit from on-chip memory and extensive I/O.
• Communication Interfaces  Protocol bridging, custom I/O handling and front-end logic for communication systems using the device's I/O and logic resources.
• Embedded Processing  Custom accelerators, signal conditioning and glue logic for embedded systems leveraging the FPGA’s logic and RAM.

Unique Advantages

• Automotive-Grade Qualification: AEC‑Q100 qualification supports deployment in vehicle systems requiring standardized reliability.
• Significant Logic and Memory in a Compact Package: 74,637 logic elements and approximately 3.17 Mbits of embedded RAM in a 484‑BBGA package reduce the need for external components.
• Broad I/O Count: 280 I/Os enable flexible interfacing to sensors, actuators and peripheral devices without extensive multiplexing.
• Wide Operating Temperature: Rated from -40 °C to 125 °C for operation across harsh thermal environments common in automotive and industrial applications.
• RoHS Compliant: Supports environmentally conscious manufacturing and regulatory requirements.
• Standard Surface-Mount Format: 484‑FBGA (23×23) supplier package simplifies PCB footprint planning for compact systems.

Why Choose XA6SLX75-3FGG484Q?

The XA6SLX75-3FGG484Q positions itself as a versatile FPGA option for designers needing a substantial logic fabric, embedded memory and high I/O density within an automotive-qualified device. Its specified core voltage, wide operating temperature range and RoHS compliance make it suitable for robust embedded and vehicle-level electronics where reliability and integration matter.

This device is well suited for teams building scalable control, interface or signal-processing designs that require on-chip resources to reduce external BOM and maintain compact board layouts while leveraging industry-standard qualification for long-term deployment.

Request a quote or submit an inquiry for pricing and availability to evaluate XA6SLX75-3FGG484Q for your next design project.