XA6SLX75-2CSG484Q

The XA6SLX75-2CSG484Q is a Spartan®-6 LX XA Field Programmable Gate Array (FPGA) IC from AMD, offered in a 484‑ball CSPBGA (484‑FBGA) package. It combines a high logic capacity, substantial on-chip memory, and a large I/O count to address complex digital functions in applications that require automotive qualification and extended temperature operation.

With AEC‑Q100 qualification and an operating range of −40 °C to 125 °C, this device is suited to designs where reliability in demanding environments, compact packaging, and deterministic hardware programmability are required.

Key Features

• Core Logic  Approximately 74,637 logic elements for implementing complex custom digital architectures and state machines.
• Embedded Memory  Approximately 3.17 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage without external memory.
• I/O Capacity  328 general-purpose I/O pins to support multiple interfaces, sensor/actuator connections, and system-level integration.
• Power Supply  Core voltage supply range of 1.14 V to 1.26 V to match system power-rail requirements.
• Package and Mounting  484‑CSPBGA (19 × 19) surface-mount package (484‑FBGA) for high-density, board-level integration.
• Automotive Qualification & Temperature  AEC‑Q100 qualified and rated for operation from −40 °C to 125 °C, supporting automotive-grade reliability targets.
• Environmental Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Automotive Control Systems  Used in vehicle electronics where AEC‑Q100 qualification and extended temperature range are required for reliable in-vehicle processing and control.
• Sensor and Actuator Interfaces  High I/O count supports direct interfacing to multiple sensors and actuators for real-time signal conditioning and control logic.
• Embedded Hardware Acceleration  On-chip logic and RAM enable custom hardware acceleration for compute- or latency-sensitive tasks within constrained form factors.

Unique Advantages

• Automotive‑grade reliability: AEC‑Q100 qualification and −40 °C to 125 °C operating range support deployment in harsh automotive environments.
• High logic capacity: ~74,637 logic elements allow implementation of sizeable custom logic, state machines, and data paths on-chip.
• Substantial on‑chip memory: Approximately 3.17 Mbits of embedded RAM reduces dependency on external memory for buffering and temporary storage.
• Extensive I/O availability: 328 I/O pins provide flexibility for system integration and multiple peripheral connections without additional bridging hardware.
• Compact, high-density package: 484‑CSPBGA (19×19) surface-mount package delivers dense integration for space-constrained boards.
• Regulatory alignment: RoHS compliance helps streamline manufacturing and environmental qualification processes.

Why Choose XA6SLX75-2CSG484Q?

The XA6SLX75-2CSG484Q positions itself as a robust, automotive‑qualified FPGA solution combining sizable logic resources, embedded memory, and high I/O density in a compact surface-mount package. Its AEC‑Q100 qualification and extended temperature range make it appropriate for engineers designing vehicle electronics and other systems that must withstand demanding thermal and reliability requirements.

Backed by AMD and the Spartan‑6 LX family, this device offers a balanced combination of integration and reliability for teams seeking to implement custom hardware functions, offload compute tasks, or consolidate multiple discrete components into a programmable silicon solution.

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