XA6SLX45T-3FGG484I

The XA6SLX45T-3FGG484I is a Spartan®-6 LXT XA field programmable gate array (FPGA) supplied in a 484-ball BGA package. It delivers a programmable logic platform with substantial logic capacity, on-chip memory, and a high I/O count for designs that require configurable digital logic in qualified environments.

With automotive grade qualification (AEC‑Q100), a wide operating temperature range and RoHS compliance, this device targets applications that demand reliability across demanding temperature ranges while offering flexibility through programmable logic and abundant I/O.

Key Features

• Logic Capacity — Provides 43,661 logic elements for implementing complex digital functions and custom hardware accelerators.
• Embedded Memory — Approximately 2.14 Mbits of on-chip RAM to support buffering, state machines, and local data storage without external memory.
• I/O Density — 296 user I/O pins to interface with sensors, peripherals, and external logic domains.
• Package and Mounting — Available in a 484-BBGA package; supplier device package listed as 484-FBGA (23×23). Designed for surface-mount PCB assembly.
• Power — Core voltage supply range of 1.14 V to 1.26 V to match system power rails and regulator designs.
• Temperature and Qualification — Automotive grade with AEC‑Q100 qualification and an operating temperature range of −40 °C to 100 °C for use in temperature-challenging environments.
• Compliance — RoHS compliant for regulatory and environmental conformity.

Typical Applications

• Automotive Control Systems — Suitable for vehicle electronic modules where AEC‑Q100 qualification and a wide operating temperature range are required for reliability.
• Embedded and Industrial Control — High logic capacity and 296 I/Os support custom control, signal conditioning, and interface consolidation in rugged environments.
• Custom Digital Interfaces — Programmable fabric and on-chip memory enable implementation of bespoke protocol bridges, data aggregation, and real-time logic functions.

Unique Advantages

• Substantial Logic Resources: 43,661 logic elements give designers room to implement complex, integrated digital designs on a single device.
• On-Chip Memory for Local Processing: Approximately 2.14 Mbits of embedded RAM reduces dependency on external memory for buffering and state retention.
• High I/O Count: 296 I/O pins allow flexible interfacing to multiple peripherals and mixed-signal domains without extensive glue logic.
• Automotive Qualification: AEC‑Q100 qualification and automotive grade designation support deployment in vehicle electronics and other safety-conscious applications.
• Compact BGA Packaging: 484-ball BGA (supplier package 484-FBGA, 23×23) balances I/O density with a compact PCB footprint for space-constrained designs.
• Wide Operating Range: Core voltage tolerance from 1.14 V to 1.26 V and an operating temperature window of −40 °C to 100 °C enable robust operation across varied environments.

Why Choose XA6SLX45T-3FGG484I?

The XA6SLX45T-3FGG484I positions itself as a robust, automotive‑qualified FPGA option combining significant logic capacity, embedded memory, and a high I/O count in a compact BGA package. Its AEC‑Q100 qualification and −40 °C to 100 °C operating range make it suitable for designs that must meet automotive or otherwise challenging thermal requirements while retaining the flexibility of programmable logic.

This device is well suited to engineers building designs that require scalable, reliable programmable logic with on-chip resources to minimize external components. Its combination of integration, qualification, and I/O density supports long-term value through reduced BOM complexity and design flexibility.

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