XA6SLX75-2FGG484Q

The XA6SLX75-2FGG484Q is a Spartan®-6 LX XA Field Programmable Gate Array (FPGA) IC offering high logic density and on-chip memory in a compact ball-grid array package. It is a programmable logic device designed for applications that require substantial logic resources, embedded memory, and a large number of configurable I/O connections.

With a broad operating temperature range and AEC-Q100 qualification, this device targets applications where reliability and qualification matter, while providing a balance of logic capacity, I/O count, and power characteristics suitable for system-level integration.

Key Features

• Logic Capacity  Approximately 74,637 logic elements provide significant resources for custom digital logic, finite state machines, and parallel processing implementations.
• Configurable Logic Blocks (CLBs)  5,831 CLBs enable structured placement of logic for deterministic design scaling.
• Embedded Memory  Approximately 3.17 Mbits of on-chip RAM support local data buffering, FIFOs, and state storage without external memory.
• I/O Density  280 programmable I/O pins allow extensive interfacing to sensors, peripherals, and external buses.
• Power  Core supply range of 1.14 V to 1.26 V supports low-voltage system architectures.
• Package & Mounting  484-BBGA package (supplier device package: 484-FBGA, 23×23) in a surface-mount format for compact board layouts.
• Qualification & Temperature Range  Automotive grade with AEC-Q100 qualification and an operating temperature range of –40 °C to 125 °C for environments requiring qualified components.
• Environmental Compliance  RoHS compliant to meet lead-free and hazardous-substance requirements.

Typical Applications

• Automotive control systems  AEC-Q100 qualification and a –40 °C to 125 °C operating range make this FPGA suitable for in-vehicle control logic, sensor interfacing, and data aggregation tasks that require qualified silicon.
• Custom signal processing  Approximately 74,637 logic elements and 3.17 Mbits of embedded memory enable implementation of bespoke signal-processing pipelines, buffering, and protocol handling on-chip.
• Interface consolidation and bridging  With 280 I/O pins, the device can consolidate multiple peripheral interfaces and implement protocol bridging without extensive external logic.
• Embedded system integration  Compact 484-BBGA surface-mount packaging and low core voltage simplify integration into space-constrained boards and modern low-voltage designs.

Unique Advantages

• High logic and memory integration: Combines substantial logic resources with approximately 3.17 Mbits of embedded RAM to reduce dependence on external memory and discrete logic devices.
• Qualified for automotive environments: AEC‑Q100 qualification and extended temperature range support designs that require industry-recognized qualification and thermal robustness.
• Large, flexible I/O complement: 280 I/O pins provide designers with broad connectivity options to simplify board-level interfacing and reduce the need for additional IO expanders.
• Compact, surface-mount BBGA package: The 484-ball FBGA (23×23) footprint enables high-density board placement while maintaining a reliable solderable package.
• Low-voltage core operation: 1.14 V to 1.26 V core supply aligns with modern low-voltage system domains and power budgets.
• RoHS compliant: Meets environmental and manufacturing requirements for lead‑free assemblies.

Why Choose XA6SLX75-2FGG484Q?

The XA6SLX75-2FGG484Q positions itself as a high-capacity, qualified FPGA option for designs that require a balance of logic density, embedded memory, and extensive I/O in a compact package. Its AEC‑Q100 qualification and wide operating temperature range make it suitable for applications where component qualification and thermal tolerance are required.

This device is well suited to engineers building complex embedded systems, automotive control modules, and interface- or processing-heavy applications that need on-chip resources to minimize external components and simplify system architecture. The combination of logic capacity, memory, and I/O delivers a scalable, reliable building block that supports long-term design lifecycles.

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