XA6SLX75T-2FGG484I

The XA6SLX75T-2FGG484I is a Spartan‑6 LXT XA Field Programmable Gate Array (FPGA) supplied in a 484‑BBGA package. It provides a balance of on-chip logic capacity, embedded memory, and a high count of I/O in a surface‑mount BGA footprint.

With automotive grading and AEC‑Q100 qualification, a defined core voltage range, and an extended operating temperature span, this device is specified to support designs that require verified environmental tolerance and a compact, high‑density integration of programmable logic resources.

Key Features

• FPGA Core Spartan‑6 LXT XA FPGA architecture delivered in a 484‑BBGA package for surface‑mount assembly.
• Logic Capacity Approximately 74,637 logic elements available for implementing custom digital functions.
• Embedded Memory Approximately 3.17 Mbits of on‑chip RAM to support buffering, state machines, and local data storage.
• I/O Density 268 user I/O pins to enable flexible interfacing with external peripherals and subsystems.
• Package and Mounting 484‑BBGA (supplier package listed as 484‑FBGA, 23 × 23 mm) in a surface‑mount format for compact board layouts.
• Power Specified core voltage range of 1.14 V to 1.26 V to guide power‑supply design and sequencing.
• Environmental and Qualification Automotive grade with AEC‑Q100 qualification and an operating temperature range of −40 °C to 100 °C.
• Compliance RoHS‑compliant for environmental regulations related to hazardous substances.

Typical Applications

• Automotive systems — AEC‑Q100 qualification and automotive grade designation make this device suitable for vehicle electronics requiring specified environmental performance.
• High‑density I/O interfaces — 268 I/O pins support complex interfacing tasks where multiple signals and buses must be managed from a compact FPGA package.
• Embedded programmable logic — ~74,637 logic elements and ~3.17 Mbits of embedded memory enable implementation of custom hardware accelerators, glue logic, and protocol handling within a single device.

Unique Advantages

• Automotive qualification: AEC‑Q100 rating and automotive grade classification provide a documented basis for use in automotive designs.
• Substantial logic resources: Approximately 74,637 logic elements accommodate complex logic and custom functional partitioning on‑chip.
• On‑chip memory: Around 3.17 Mbits of embedded RAM reduces reliance on external memory for many real‑time buffering and state storage needs.
• High I/O count: 268 I/O pins give designers flexibility for parallel interfaces, sensor arrays, and multi‑bus connectivity.
• Compact, production‑ready package: 484‑BBGA (484‑FBGA, 23 × 23 mm) surface‑mount package supports dense PCB layouts while simplifying assembly.
• Defined operating range: Core voltage specified at 1.14–1.26 V and operating temperature from −40 °C to 100 °C aid system power and thermal planning.

Why Choose XA6SLX75T-2FGG484I?

The XA6SLX75T-2FGG484I positions itself as a compact, automotive‑qualified FPGA option that combines significant programmable logic capacity, embedded memory, and a high number of I/O in a space‑efficient BGA package. Its defined voltage and temperature specifications provide determinism for designs that require documented environmental and power parameters.

This device is suited for engineers building systems that need integrated programmable logic with automotive qualification and a high degree of I/O and on‑chip memory—offering a clear specification set that aids system design, power planning, and PCB layout decisions.

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