XA6SLX9-2FTG256I
| Part Description |
Spartan®-6 LX XA Field Programmable Gate Array (FPGA) IC 186 589824 9152 256-LBGA |
|---|---|
| Quantity | 1,284 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Automotive | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 186 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 715 | Number of Logic Elements/Cells | 9152 | ||
| Number of Gates | N/A | ECCN | 3A001A7B | HTS Code | 8542.39.0001 | ||
| Qualification | AEC-Q100 | Total RAM Bits | 589824 |
Overview of XA6SLX9-2FTG256I – Spartan®-6 LX FPGA, 186 I/O, 256-LBGA
The XA6SLX9-2FTG256I is a Spartan®-6 LX field programmable gate array (FPGA) IC offered in a 256-LBGA package. It provides a balance of programmable logic, embedded memory, and I/O count suited for embedded and automotive electronic designs where AEC-Q100 qualification is required.
Key on-chip resources include 9,152 logic elements and approximately 0.59 Mbits of embedded memory, together with 186 user I/Os. The device operates from a core supply of 1.14 V to 1.26 V and is specified for operation from -40 °C to 100 °C.
Key Features
- Programmable Logic — 9,152 logic elements provide flexible gate-array resources for custom digital functions.
- Logic Structure — 715 configurable logic blocks (CLBs) support partitioning of user logic across the device.
- Embedded Memory — Approximately 0.59 Mbits of on-chip RAM (589,824 bits) for buffering, FIFOs, and local storage.
- I/O Capability — 186 user I/Os to interface with peripherals, sensors, and external devices.
- Automotive Qualification — Grade: Automotive with AEC-Q100 qualification for designs requiring automotive-grade components.
- Package & Mounting — 256-LBGA supplier package (256-FTBGA, 17×17) with surface-mount mounting type for PCB assembly.
- Power and Temperature — Core voltage range of 1.14 V to 1.26 V and operating temperature range of -40 °C to 100 °C for wide environmental tolerance.
- Regulatory — RoHS compliant.
Typical Applications
- Automotive Embedded Control — AEC-Q100 qualification and -40 °C to 100 °C operating range make this FPGA suitable for in-vehicle control and sensor-processing modules.
- Interface Bridging and I/O Expansion — 186 user I/Os allow integration of multiple interfaces and peripheral routing in compact systems.
- Custom Logic and Prototyping — On-chip logic and memory resources enable implementation of custom digital functions and prototyping of embedded designs.
Unique Advantages
- Automotive-Grade Qualification: AEC-Q100 rating supports use in designs that require automotive component qualification and traceability.
- Balanced On-Chip Resources: Combination of 9,152 logic elements and approximately 0.59 Mbits of RAM provides local implementation capacity without external memory for many control and interfacing tasks.
- High I/O Count: 186 user I/Os simplify integration with sensors, actuators, and external devices, reducing the need for additional interface ICs.
- Compact Package: 256-LBGA (256-FTBGA, 17×17) surface-mount package enables dense PCB layouts while maintaining accessible I/O.
- Wide Operating Range: Specified core voltage of 1.14 V–1.26 V and -40 °C to 100 °C operating temperature support designs across varied thermal environments.
- RoHS Compliant: Meets lead-free and hazardous-substance directives for regulatory and manufacturing requirements.
Why Choose XA6SLX9-2FTG256I?
The XA6SLX9-2FTG256I positions itself as a qualified, mid-range Spartan®-6 LX FPGA option that combines programmable logic, embedded RAM, and substantial I/O in a compact 256-LBGA footprint. Its AEC-Q100 automotive qualification and extended temperature range make it appropriate for designs that demand component-level automotive robustness alongside flexible digital customization.
This device is well suited to engineers and procurement teams seeking a field-programmable solution for automotive embedded control, interface-heavy systems, and custom logic implementations where verified qualification and clear supply and thermal specifications are required.
Request a quote or submit a purchasing inquiry to obtain pricing, availability, and lead-time information for the XA6SLX9-2FTG256I.

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