XA6SLX9-3FTG256Q

The XA6SLX9-3FTG256Q is a Spartan®-6 LX XA field programmable gate array (FPGA) IC from AMD. It combines a configurable logic fabric with embedded memory and a substantial I/O count to support a range of embedded and automotive-focused electronic designs.

With 9,152 logic elements, approximately 0.59 Mbits of on-chip RAM, 186 I/Os, and AEC-Q100 qualification, this device targets applications that require moderate logic density, significant local memory, and automotive-grade temperature and qualification coverage.

Key Features

• Core Logic — 9,152 logic elements implemented across 715 configurable logic blocks (CLBs) for custom digital logic and control functions.
• Embedded Memory — Approximately 0.59 Mbits of on-chip RAM for buffering, state storage, and local data processing.
• I/O — 186 user I/Os to support broad interfacing needs with sensors, peripherals, and system buses.
• Power — Core supply voltage range of 1.14 V to 1.26 V for predictable power-regulation design.
• Package & Mounting — 256-LBGA package (supplier package 256-FTBGA, 17×17) with surface-mount mounting for compact PCB integration.
• Automotive Qualification & Temperature Range — Grade: Automotive with AEC-Q100 qualification and operating temperature range of -40°C to 125°C.
• Environmental Compliance — RoHS compliant for lead-free assembly and regulatory alignment.

Typical Applications

• Automotive electronics — Deployable in vehicle electronic subsystems that require AEC-Q100 qualification and extended temperature capability.
• Embedded control systems — Suitable for controllers and custom logic implementations where mid-range logic density and on-chip RAM are required.
• Prototyping and system integration — Useful for board-level evaluation and integration of custom digital functions with a high I/O count and compact LBGA footprint.

Unique Advantages

• Automotive-qualified design: AEC-Q100 qualification and a -40°C to 125°C operating range support deployment in automotive environments.
• Balanced logic and memory: 9,152 logic elements paired with approximately 0.59 Mbits of embedded RAM enable a range of moderate-complexity designs without immediate need for external memory.
• Generous I/O availability: 186 I/Os reduce the need for external expanders and simplify board-level connectivity for multi-signal systems.
• Compact, surface-mount package: 256-LBGA (256-FTBGA, 17×17) supports dense PCB layouts and standard surface-mount assembly processes.
• Predictable power window: Narrow core supply range (1.14–1.26 V) simplifies power-regulation planning.
• RoHS compliant: Conforms to lead-free environmental standards for modern manufacturing.

Why Choose XA6SLX9-3FTG256Q?

The XA6SLX9-3FTG256Q positions itself as a reliable, automotive-qualified FPGA option that balances logic density, embedded memory, and I/O capacity within a compact 256-LBGA package. Its AEC-Q100 qualification and wide operating temperature range make it suitable for designs requiring automotive-grade robustness while retaining flexibility for a variety of embedded applications.

This device is ideal for engineers and teams designing automotive subsystems and embedded platforms that need a moderate amount of programmable logic, local RAM, and a high I/O count—all within a surface-mount LBGA footprint and predictable power envelope.

Request a quote or submit an inquiry to sales to discuss pricing, availability, and how the XA6SLX9-3FTG256Q can fit into your next design.