XA7A100T-1FGG484I
| Part Description |
Artix-7 XA Field Programmable Gate Array (FPGA) IC 285 4976640 101440 484-BBGA |
|---|---|
| Quantity | 627 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Automotive | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 285 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 7925 | Number of Logic Elements/Cells | 101440 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | AEC-Q100 | Total RAM Bits | 4976640 |
Overview of XA7A100T-1FGG484I – Artix-7 XA Field Programmable Gate Array (FPGA) 484-BBGA
The XA7A100T-1FGG484I is an Artix‑7 XA Field Programmable Gate Array (FPGA) in a 484‑BBGA package designed for embedded logic integration. It delivers substantial logic capacity, a high I/O count and on‑chip memory suitable for designs requiring mid‑to‑high logic density with strict environmental and qualification requirements.
With 101,440 logic elements, approximately 4.98 Mbits of embedded memory and 285 user I/Os, this device targets applications that need significant programmable logic, deterministic I/O connectivity and an automotive‑grade qualification (AEC‑Q100).
Key Features
- Logic Capacity 101,440 logic elements provide the programmable fabric for implementing complex custom logic and state machines.
- Embedded Memory Approximately 4.98 Mbits of on‑chip RAM for buffering, FIFOs and on‑device data storage.
- I/O Density 285 user I/Os support plentiful external connectivity for sensors, actuators and peripheral interfaces.
- Power Supply Core voltage supply range of 950 mV to 1.05 V to match system power rails and power sequencing requirements.
- Package & Mounting 484‑BBGA package (supplier device package: 484‑FBGA, 23×23) in a surface‑mount form factor for compact board layouts.
- Automotive Qualification & Temperature Range AEC‑Q100 qualification and an operating temperature range of −40 °C to 100 °C enable deployment in temperature‑sensitive and automotive environments.
- Regulatory Compliance RoHS compliant, supporting regulatory and environmental requirements for lead‑free assemblies.
Typical Applications
- Automotive electronic systems Suitable for deployment in automotive designs that require AEC‑Q100 qualification and extended temperature operation.
- Embedded control and logic Implements custom processing, control logic and glue logic where substantial programmable resources and multiple I/Os are required.
- I/O‑heavy interface hubs Acts as a central programmable interface for designs needing dozens to hundreds of external connections.
Unique Advantages
- Automotive‑grade qualification: AEC‑Q100 qualification and an operating range of −40 °C to 100 °C support deployment in demanding automotive environments.
- High logic and memory integration: 101,440 logic elements and approximately 4.98 Mbits of embedded memory reduce external component count and simplify system architecture.
- Generous I/O count: 285 user I/Os enable flexible connectivity to sensors, actuators and peripherals without additional interface chips.
- Compact surface‑mount package: 484‑BBGA (484‑FBGA, 23×23) allows dense PCB layouts while maintaining robust mechanical attachment.
- Controlled core power range: A defined supply window of 950 mV to 1.05 V supports predictable power integration and sequencing in multi‑rail designs.
- RoHS compliant: Meets lead‑free environmental compliance requirements for modern electronics manufacturing.
Why Choose XA7A100T-1FGG484I?
The XA7A100T-1FGG484I combines substantial programmable logic, embedded memory and a high I/O count in an automotive‑qualified package, making it a strong choice for designers who need reliable, on‑board programmable resources under extended temperature conditions. Its surface‑mount 484‑BBGA footprint and defined power envelope simplify integration into space‑constrained, regulated designs.
This device is well suited to teams developing automotive and other temperature‑sensitive embedded systems that require scalable logic capacity, abundant I/O and on‑device memory while maintaining industry environmental compliance.
Request a quote or submit an inquiry to receive pricing and availability for XA7A100T-1FGG484I and to discuss how this FPGA fits your design requirements.

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