XA7A100T-1FGG484I

IC FPGA 285 I/O 484FBGA
Part Description

Artix-7 XA Field Programmable Gate Array (FPGA) IC 285 4976640 101440 484-BBGA

Quantity 627 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeAutomotiveOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O285Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs7925Number of Logic Elements/Cells101440
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationAEC-Q100Total RAM Bits4976640

Overview of XA7A100T-1FGG484I – Artix-7 XA Field Programmable Gate Array (FPGA) 484-BBGA

The XA7A100T-1FGG484I is an Artix‑7 XA Field Programmable Gate Array (FPGA) in a 484‑BBGA package designed for embedded logic integration. It delivers substantial logic capacity, a high I/O count and on‑chip memory suitable for designs requiring mid‑to‑high logic density with strict environmental and qualification requirements.

With 101,440 logic elements, approximately 4.98 Mbits of embedded memory and 285 user I/Os, this device targets applications that need significant programmable logic, deterministic I/O connectivity and an automotive‑grade qualification (AEC‑Q100).

Key Features

  • Logic Capacity  101,440 logic elements provide the programmable fabric for implementing complex custom logic and state machines.
  • Embedded Memory  Approximately 4.98 Mbits of on‑chip RAM for buffering, FIFOs and on‑device data storage.
  • I/O Density  285 user I/Os support plentiful external connectivity for sensors, actuators and peripheral interfaces.
  • Power Supply  Core voltage supply range of 950 mV to 1.05 V to match system power rails and power sequencing requirements.
  • Package & Mounting  484‑BBGA package (supplier device package: 484‑FBGA, 23×23) in a surface‑mount form factor for compact board layouts.
  • Automotive Qualification & Temperature Range  AEC‑Q100 qualification and an operating temperature range of −40 °C to 100 °C enable deployment in temperature‑sensitive and automotive environments.
  • Regulatory Compliance  RoHS compliant, supporting regulatory and environmental requirements for lead‑free assemblies.

Typical Applications

  • Automotive electronic systems  Suitable for deployment in automotive designs that require AEC‑Q100 qualification and extended temperature operation.
  • Embedded control and logic  Implements custom processing, control logic and glue logic where substantial programmable resources and multiple I/Os are required.
  • I/O‑heavy interface hubs  Acts as a central programmable interface for designs needing dozens to hundreds of external connections.

Unique Advantages

  • Automotive‑grade qualification: AEC‑Q100 qualification and an operating range of −40 °C to 100 °C support deployment in demanding automotive environments.
  • High logic and memory integration: 101,440 logic elements and approximately 4.98 Mbits of embedded memory reduce external component count and simplify system architecture.
  • Generous I/O count: 285 user I/Os enable flexible connectivity to sensors, actuators and peripherals without additional interface chips.
  • Compact surface‑mount package: 484‑BBGA (484‑FBGA, 23×23) allows dense PCB layouts while maintaining robust mechanical attachment.
  • Controlled core power range: A defined supply window of 950 mV to 1.05 V supports predictable power integration and sequencing in multi‑rail designs.
  • RoHS compliant: Meets lead‑free environmental compliance requirements for modern electronics manufacturing.

Why Choose XA7A100T-1FGG484I?

The XA7A100T-1FGG484I combines substantial programmable logic, embedded memory and a high I/O count in an automotive‑qualified package, making it a strong choice for designers who need reliable, on‑board programmable resources under extended temperature conditions. Its surface‑mount 484‑BBGA footprint and defined power envelope simplify integration into space‑constrained, regulated designs.

This device is well suited to teams developing automotive and other temperature‑sensitive embedded systems that require scalable logic capacity, abundant I/O and on‑device memory while maintaining industry environmental compliance.

Request a quote or submit an inquiry to receive pricing and availability for XA7A100T-1FGG484I and to discuss how this FPGA fits your design requirements.

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