XA6SLX45-3CSG324Q

The XA6SLX45-3CSG324Q is a Spartan®-6 LX XA Field Programmable Gate Array (FPGA) in a 324-pin CSPBGA package. It provides a balance of logic capacity, embedded memory and I/O resources in an automotive-grade, surface-mount FPGA form factor.

With AEC-Q100 qualification, an extended operating range from -40 °C to 125 °C and a nominal supply window of 1.14 V to 1.26 V, this device addresses designs that require higher reliability and temperature robustness while offering substantial on-chip resources for embedded logic and buffering.

Key Features

• Logic Capacity 43,661 logic elements (cells) to implement combinational and sequential logic for complex control, data handling and custom functions.
• Embedded Memory Approximately 2.14 Mbits of on-chip RAM for buffering, frame storage and intermediate data processing.
• I/O Resources 218 user I/O pins to support a wide range of external interfaces and peripherals.
• Package & Mounting 324-LFBGA / 324-CSPBGA (15×15) surface-mount package for compact PCB integration.
• Power Designed for operation from a 1.14 V to 1.26 V supply range.
• Temperature & Qualification Automotive-grade device qualified to AEC-Q100 with an operating temperature range of -40 °C to 125 °C.
• RoHS Compliance RoHS-compliant manufacturing status.

Typical Applications

• Automotive control systems — AEC-Q100 qualification and -40 °C to 125 °C operation make the device suitable for control, gateway or body electronics where extended temperature and qualification are required.
• Sensor aggregation and preprocessing — Logic density and on-chip RAM enable aggregation, filtering and preprocessing of sensor data before handing off to higher-level controllers.
• Embedded protocol bridging — 218 I/Os allow interfacing between multiple peripherals and buses, supporting custom protocol logic and signal conditioning.

Unique Advantages

• Automotive-qualified silicon: AEC-Q100 qualification supports deployment in automotive environments that require component-level qualification.
• Substantial logic integration: 43,661 logic elements consolidate custom logic blocks into a single programmable device, reducing board-level complexity.
• On-chip memory capacity: Approximately 2.14 Mbits of embedded RAM provides local buffering and temporary storage to reduce external memory requirements.
• High I/O count: 218 user I/Os accommodate multiple peripheral connections and mixed-signal interface requirements.
• Robust thermal range: Rated from -40 °C to 125 °C for designs targeting wide ambient temperature operation.
• Compact CSPBGA package: 324-pin CSPBGA (15×15) supports dense PCB layouts while remaining surface-mount compatible.

Why Choose XA6SLX45-3CSG324Q?

The XA6SLX45-3CSG324Q positions itself as a reliable, automotive-qualified FPGA option that combines a high number of logic elements, significant embedded memory and a large I/O complement in a compact 324-pin CSPBGA package. Its AEC-Q100 qualification and extended temperature range make it suitable for designs that require component-level automotive reliability.

This device is well suited to engineers designing control modules, sensor aggregation systems and embedded protocol logic where integrated logic capacity, on-chip RAM and a broad I/O set reduce system complexity and support long-term robustness in challenging thermal environments.

Request a quote or contact sales to check availability and pricing for the XA6SLX45-3CSG324Q and to discuss how it can fit into your next design.