XA6SLX45-3CSG324I

The XA6SLX45-3CSG324I is a Spartan®-6 LX XA field programmable gate array (FPGA) offered in a 324-lead LFBGA / CSPBGA package. It provides a large logic fabric with 43,661 logic elements, approximately 2.14 Mbits of embedded memory, and 218 general-purpose I/O pins in a compact surface-mount package.

Designed to meet AEC-Q100 automotive qualification and a wide operating temperature range of −40°C to 100°C, this device supports systems requiring high integration, on-chip memory capacity, and dense I/O in a 15×15 324-CSPBGA package with a 1.14–1.26 V core supply.

Key Features

• FPGA Core Spartan®-6 LX XA architecture implemented in a field programmable gate array for flexible hardware acceleration and custom logic integration.
• Logic Capacity 43,661 logic elements to implement complex digital functions and custom processing pipelines.
• Embedded Memory Approximately 2.14 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage without external memory.
• Rich I/O 218 I/O pins for broad peripheral connectivity and interface consolidation on a single device.
• Automotive Qualification AEC-Q100 qualification for applications requiring automotive-grade component qualification and reliability.
• Package and Mounting Available in a 324-LFBGA / 324-CSPBGA (15×15) surface-mount package to enable high-density PCB layouts.
• Power Core voltage supply range of 1.14 V to 1.26 V for predictable power budgeting and system design.
• Extended Temperature Range Operating range from −40°C to 100°C to support thermal environments encountered in demanding applications.
• RoHS Compliant Conforms to RoHS requirements for environmental and regulatory compliance.

Unique Advantages

• High logic integration: 43,661 logic elements reduce the need for multiple discrete devices and simplify board-level integration.
• On-chip memory capacity: Approximately 2.14 Mbits of embedded RAM supports local buffering and lowers external memory dependency.
• Automotive-grade qualification: AEC-Q100 certification provides a clear qualification path for automotive and other safety-conscious designs.
• Extensive I/O count: 218 I/O pins enable consolidation of multiple interfaces and peripherals onto a single FPGA.
• Compact, high-density package: 324-CSPBGA (15×15) / 324-LFBGA packaging supports space-constrained PCB designs.
• Wide temperature and controlled core voltage: −40°C to 100°C operating range and 1.14–1.26 V supply support reliable operation across varied environments.

Why Choose XA6SLX45-3CSG324I?

The XA6SLX45-3CSG324I positions itself as a high-capacity, automotive-qualified FPGA option for designs that need substantial on-chip logic, embedded memory, and generous I/O in a compact surface-mount package. Its combination of 43,661 logic elements, approximately 2.14 Mbits of RAM, and AEC-Q100 qualification delivers a balance of integration and environmental robustness suitable for long-life and demanding applications.

Engineers and procurement teams seeking a scalable, high-density FPGA solution will find the XA6SLX45-3CSG324I advantageous for reducing BOM complexity, consolidating interfaces, and meeting temperature and qualification requirements without sacrificing logic or memory resources.

Request a quote or submit a procurement inquiry to get pricing and availability for the XA6SLX45-3CSG324I.