XA6SLX45-2FGG484I

The XA6SLX45-2FGG484I is an AMD Spartan®-6 LX XA field programmable gate array (FPGA) in a 484-ball BGA package. It provides reconfigurable logic with 43,661 logic elements, approximately 2.1 Mbits of embedded memory and 316 user I/Os for designs that require moderate logic density and extensive I/O connectivity.

Designed for surface-mount applications, this device is qualified to AEC-Q100 and specified for an operating range of −40 °C to 100 °C, with a core supply range of 1.14 V to 1.26 V. It is RoHS compliant and supplied in a 484-BBGA (484-FBGA, 23×23) package.

Key Features

• FPGA Core Spartan-6 LX XA architecture providing 43,661 logic elements for configurable digital logic and custom datapaths.
• Embedded Memory Approximately 2.1 Mbits of on-chip RAM to support buffering, state storage, and small lookup tables without external memory.
• I/O Capacity 316 user I/Os to support wide parallel interfaces, multiple peripherals, and flexible board-level connectivity.
• Power Core voltage supply range of 1.14 V to 1.26 V for systems designed around low-voltage FPGA cores.
• Package and Mounting 484-ball BGA (supplier device package: 484-FBGA, 23×23) for surface-mount assembly and compact board footprints.
• Automotive Qualification and Temperature AEC-Q100 qualified and specified for operation from −40 °C to 100 °C, suitable for designs that require automotive-grade qualification.
• Environmental Compliance RoHS compliant to meet lead-free and materials requirements in applicable markets.

Typical Applications

• Automotive Electronic Control — AEC-Q100 qualification and wide operating temperature make this FPGA suitable for automotive control modules requiring reconfigurable logic and moderate memory.
• Embedded Systems — Provides flexible logic and on-chip memory for embedded controllers, protocol bridging, and custom datapaths with extensive I/O needs.
• Industrial Control — Deployment in industrial controllers and interface units where robust temperature range and large I/O counts are required.

Unique Advantages

• Substantial Logic Capacity: 43,661 logic elements enable implementation of sizable custom logic blocks and parallel processing pipelines without immediate need for higher-density devices.
• Embedded Memory On-Board: Approximately 2.1 Mbits of RAM reduces dependence on external memory for many buffering and LUT needs, simplifying BOM and layout.
• High I/O Count: 316 user I/Os support complex interface requirements, allowing multiple peripheral connections and wide buses.
• Automotive-Grade Qualification: AEC-Q100 qualification and −40 °C to 100 °C rating support use in environments with demanding temperature and quality requirements.
• Compact BGA Package: 484-ball BGA (23×23) enables high pin count in a compact footprint for space-constrained boards.
• Regulatory Compliance: RoHS compliance supports designs targeting markets with lead-free material requirements.

Why Choose XA6SLX45-2FGG484I?

The XA6SLX45-2FGG484I positions itself as a versatile FPGA choice for designs that need a balanced combination of logic density, on-chip memory, and extensive I/O in an automotive-qualified form. Its AEC-Q100 qualification, broad temperature range and RoHS compliance make it a practical option for systems requiring proven environmental robustness.

This part is well suited to engineering teams developing embedded, automotive, or industrial applications that benefit from reconfigurable hardware, significant I/O capacity, and integrated memory—delivering a straightforward path to implementing custom logic while keeping board-level complexity manageable.

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