XA3SD3400A-4CSG484I

The XA3SD3400A-4CSG484I is a Spartan®-3A DSP XA field programmable gate array (FPGA) in a 484-ball CSPBGA package. It provides a large logic fabric and on-chip RAM suitable for designs that require substantial programmable logic, I/O capacity and embedded memory within a surface-mount package.

Key hardware attributes include 53,712 logic elements, approximately 2.3 Mbits of on-chip RAM (2,322,432 total RAM bits), 309 I/O pins, and a supported supply voltage range of 1.14 V to 1.26 V. The device is qualified to AEC-Q100 and rated for operation from −40 °C to 100 °C.

Key Features

• Logic Fabric  5,968 configurable logic blocks (CLBs) delivering 53,712 logic elements for high-density logic implementation.
• On-chip Memory  Approximately 2.3 Mbits of embedded RAM (2,322,432 total RAM bits) to support buffering, state machines and data storage within the FPGA.
• I/O Capacity  309 I/O pins to accommodate a wide range of external interfaces and peripheral connectivity.
• Gate Count  3,400,000 gates providing the device-level complexity for mixed control and processing tasks.
• Power  Supported core voltage range from 1.14 V to 1.26 V for core power planning and board-level supply design.
• Package & Mounting  484-ball FBGA / 484-CSPBGA (19×19) package in a surface-mount form factor for compact board integration.
• Automotive Qualification  Grade: Automotive with AEC-Q100 qualification, enabling use in applications requiring that industry qualification.
• Operating Range  Rated for operation from −40 °C to 100 °C to support temperature-demanding environments.
• Compliance  RoHS compliant for materials and manufacturing process conformance.

Typical Applications

• Signal processing and DSP tasks  The Spartan-3A DSP XA device name and large logic and memory resources make it suitable for designs that integrate programmable signal-processing functions alongside control logic.
• High-density logic integration  Use where tens of thousands of logic elements and millions of gates are required to consolidate multiple functions into a single FPGA.
• Interface aggregation  The 309 I/O pins support designs that need to manage multiple external peripherals and parallel interfaces from a single programmable device.

Unique Advantages

• Substantial logic capacity: 53,712 logic elements and 5,968 CLBs enable complex digital designs without immediate need for multiple devices.
• On-chip memory availability: Approximately 2.3 Mbits of embedded RAM reduces dependence on external memory for many buffering and state storage requirements.
• Robust I/O count: 309 I/O pins provide flexibility to connect numerous peripherals, sensors or parallel buses directly to the FPGA.
• Automotive-level qualification: AEC-Q100 qualification and automotive grade marking support use in applications requiring that qualification level.
• Compact surface-mount package: 484-CSPBGA (19×19) offers a high-density package format suitable for space-constrained PCBs.
• Wide operating temperature: −40 °C to 100 °C rating supports deployment in temperature-challenging environments.

Why Choose XA3SD3400A-4CSG484I?

The XA3SD3400A-4CSG484I positions itself as a high-capacity Spartan-3A DSP XA FPGA option for designs that need a combination of large programmable logic, significant embedded RAM and abundant I/O in a compact surface-mount package. Its AEC-Q100 qualification and wide operating temperature range make it appropriate for applications that demand extended environmental reliability.

Designers seeking a scalable, integrated FPGA solution with clear, verifiable hardware attributes—logic elements, on-chip memory, I/O count, package and operating conditions—will find this device suitable for consolidating functions and reducing overall system component count.

Request a quote or submit your inquiry to get pricing and availability for XA3SD3400A-4CSG484I. Our team will respond with tailored purchasing information and lead-time details.