XA2S300E-6FT256Q

The XA2S300E-6FT256Q is a Spartan®-IIE XA field programmable gate array (FPGA) IC from AMD, supplied in a 256‑ball LFBGA package. It combines a defined logic capacity with on-chip RAM and a substantial I/O count, making it suitable for designs that require programmed logic, embedded memory, and broad external connectivity.

With automotive grade qualification (AEC‑Q100) and an operating range from −40 °C to 125 °C, this device addresses designs that demand elevated temperature tolerance and long-term reliability. The device operates on a core supply between 1.71 V and 1.89 V and is RoHS compliant.

Key Features

• Core logic — 6,912 logic elements delivering up to 300,000 gates of programmable logic capacity for implementing custom digital functions.
• On‑chip memory — 65,536 bits of embedded RAM for local data buffering, small lookup tables, and state storage.
• I/O capability — 182 user I/O pins to support multiple interfaces and external peripherals without external glue logic.
• Automotive qualification — AEC‑Q100 qualification and an operating temperature range of −40 °C to 125 °C for designs requiring automotive‑grade reliability.
• Package and mounting — 256‑LBGA (supplier pkg: 256‑FTBGA 17×17) in a surface‑mount form factor for compact board integration.
• Supply voltage — Core supply range from 1.71 V to 1.89 V to match system power domains and ensure predictable power behavior.
• Environmental compliance — RoHS compliant for regulatory and manufacturing requirements.

Typical Applications

• Automotive control systems — AEC‑Q100 qualification and wide operating temperature range support deployment in vehicle electronics and control modules.
• Embedded I/O aggregation — High I/O count (182 pins) enables consolidation of multiple peripheral interfaces and sensor inputs.
• Custom logic and signal processing — 6,912 logic elements and 65,536 bits of on‑chip RAM provide local resources for implementing tailored digital processing and control functions.

Unique Advantages

• Automotive‑grade reliability: AEC‑Q100 qualification and −40 °C to 125 °C rating help meet vehicle electronics durability requirements.
• Balanced logic and memory: Combines 6,912 logic elements with on‑chip RAM to support moderate complexity designs without external FPGA resources.
• Ample I/O integration: 182 I/O pins reduce the need for additional interface chips, simplifying board-level design.
• Compact LBGA footprint: 256‑LBGA (256‑FTBGA, 17×17) enables space‑conscious PCB layouts while preserving connectivity.
• Controlled low‑voltage operation: Narrow supply window (1.71 V–1.89 V) supports predictable power sequencing and integration with low‑voltage systems.
• Regulatory readiness: RoHS compliance supports environmentally constrained manufacturing and supply chains.

Why Choose XA2S300E-6FT256Q?

The XA2S300E-6FT256Q positions itself as a reliable, automotive‑qualified FPGA option that balances programmable logic capacity, on‑chip RAM, and a high I/O count in a compact 256‑LBGA package. Its specification set—6,912 logic elements, 65,536 bits of embedded memory, 182 I/O, and 300,000 gates—provides clear, verifiable resources for designs that require deterministic programmable logic and substantial external connectivity.

Choose this device when you need a field‑programmable device with automotive qualification (AEC‑Q100), broad operating temperature capability, and RoHS compliance—delivering predictable electrical and environmental characteristics for long‑life production designs.

Request a quote or submit a procurement inquiry to receive pricing and availability for the XA2S300E-6FT256Q. Please include your required quantities and lead‑time expectations when requesting a quote.