XA2S200E-6FT256I

The XA2S200E-6FT256I is a Spartan®-IIE XA field programmable gate array (FPGA) IC manufactured by AMD. It provides a balance of programmable logic, on-chip memory, and I/O capacity in a compact 256-LBGA package for applications that require moderate logic density and automotive-grade qualification.

Designed for environments requiring extended temperature range and automotive qualification, this device targets embedded and vehicle-focused designs that need configurable logic, dedicated I/O, and on-chip RAM within a small surface-mount footprint.

Key Features

• Programmable Logic  Approximately 5,292 logic elements enabling custom digital functions and glue-logic implementations.
• Logic Capacity  Around 200,000 gates of combinational and sequential logic resources for mid-range FPGA tasks.
• On-Chip Memory  Approximately 57 Kbits (57,344 bits) of embedded RAM for buffering, small lookup tables, and state storage.
• I/O Resources  182 general-purpose I/O pins to support parallel interfaces, signal aggregation, and board-level connectivity.
• Power  Low-voltage core operation with a supply range of 1.71 V to 1.89 V for the core rails.
• Package & Mounting  256-LBGA (supplier package: 256-FTBGA, 17×17) in a surface-mount form factor for compact board designs.
• Automotive Qualification & Temperature  Grade: Automotive with AEC-Q100 qualification and an operating temperature range of −40°C to 100°C for deployment in vehicle environments.
• Compliance  RoHS compliant to meet environmental and material requirements.

Typical Applications

• Automotive Control Systems  Suited for vehicle subsystems requiring automotive-qualified programmable logic for sensor interfacing, signal conditioning, and control logic.
• Embedded Processing  Use in embedded platforms that need customizable logic and moderate on-chip memory for protocol handling or peripheral bridging.
• Communications and I/O Aggregation  Consolidate multiple I/O signals and implement custom interface logic with the device’s 182 I/O pins.

Unique Advantages

• Automotive-Grade Qualification:  AEC-Q100 qualification and a −40°C to 100°C operating range provide suitability for vehicle-level deployments.
• Compact BGA Package:  256-LBGA (17×17) enables high-density board integration while maintaining surface-mount assembly.
• Balanced Logic and Memory:  Approximately 5,292 logic elements and ~57 Kbits of embedded RAM support a variety of mid-range FPGA tasks without external memory for small buffering needs.
• Generous I/O Count:  182 I/O pins offer flexibility for multi-signal interfacing, peripheral connectivity, and custom bus implementations.
• Low-Voltage Core Operation:  Core supply from 1.71 V to 1.89 V supports designs targeting low-voltage FPGA cores and system power optimization.
• RoHS Compliant:  Meets environmental material restrictions to support compliant production builds.

Why Choose XA2S200E-6FT256I?

The XA2S200E-6FT256I positions itself as an automotive-qualified, mid-density FPGA option from AMD, combining several thousand logic elements, on-chip RAM, and a high I/O count in a compact 256-LBGA package. Its AEC-Q100 qualification and wide operating temperature range make it appropriate for vehicle-focused designs that require programmable logic under automotive conditions.

This device is well suited for engineers designing embedded or automotive applications that need configurable logic, moderate on-chip memory, and substantial I/O in a surface-mount BGA form factor, while meeting RoHS material requirements.

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