XA2S200E-6FT256Q

The XA2S200E-6FT256Q is a Spartan®-IIE XA Field Programmable Gate Array (FPGA) in a 256‑LBGA package, designed for mid-density logic integration. It provides 5,292 logic elements, approximately 57 Kbits of embedded memory and 182 I/O pins in a 17×17 256‑FTBGA footprint, making it suitable for designs that require moderate logic capacity with significant I/O density.

Qualified to AEC‑Q100 and rated for operation from −40 °C to 125 °C, this device targets applications demanding controlled-voltage operation (1.71 V to 1.89 V) and robustness in demanding thermal environments.

Key Features

• Logic Capacity — 5,292 logic elements to implement combinational and sequential logic functions for mid-density designs.
• Embedded Memory — Approximately 57 Kbits of on-chip RAM for small data buffers, state storage and local memory needs.
• I/O Density — 182 I/O pins to support multiple interfaces, peripheral connectivity and board-level routing flexibility.
• Gate Equivalent — 200,000 gates for estimating integration of glue logic and custom processing blocks.
• Power and Voltage — Specified core supply range of 1.71 V to 1.89 V for controlled-voltage system designs.
• Package and Mounting — 256‑LBGA package (supplier package: 256‑FTBGA, 17×17) with surface-mount mounting for compact board layouts.
• Automotive Qualification — AEC‑Q100 qualification and automotive grade designation for vehicle-grade system integration.
• Operating Range — Rated for −40 °C to 125 °C to support deployment in temperature-challenging environments.
• RoHS Compliance — Environmentally compliant manufacturing and materials.

Typical Applications

• Automotive control modules — AEC‑Q100 qualification and −40 °C to 125 °C operating range make this FPGA suitable for in-vehicle control logic and domain-specific processing blocks.
• Harsh-environment embedded systems — The extended temperature rating and automotive grade support designs exposed to wide thermal excursions.
• I/O‑intensive protocol bridging — 182 I/O pins provide the connectivity needed for protocol conversion, interface aggregation and board-level glue logic.
• Mid-density logic integration — 5,292 logic elements and on-chip RAM enable consolidation of discrete logic and small state machines into a single FPGA.

Unique Advantages

• Qualified for automotive applications: AEC‑Q100 qualification and automotive grade designation provide confidence for vehicle system integration and longevity.
• Broad operating temperature: −40 °C to 125 °C rating supports deployment in thermally demanding environments without additional thermal derating.
• High I/O count: 182 I/O pins reduce the need for external switches or GPIO expanders, simplifying board design and lowering BOM complexity.
• Compact BGA package: 256‑LBGA / 256‑FTBGA (17×17) package enables dense PCB layouts while maintaining robust signal routing.
• Predictable power envelope: Defined core voltage range (1.71 V–1.89 V) facilitates power-supply planning and system-level integration.
• RoHS compliant: Uses compliant materials for regulatory and environmental alignment.

Why Choose XA2S200E-6FT256Q?

The XA2S200E-6FT256Q positions itself as a reliable mid-density FPGA option for designers who need a balance of logic capacity, embedded memory and a high I/O count in a compact BGA footprint. Its AEC‑Q100 qualification and extended temperature range make it especially relevant for automotive and other harsh-environment applications where component-level qualification and thermal performance matter.

For teams consolidating board-level logic, implementing protocol interfaces, or developing robust embedded controllers, this FPGA delivers a combination of integration, predictable power requirements and package density that supports scalable system designs and long-term deployment.

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