XA2S150E-6FT256Q

The XA2S150E-6FT256Q is a Spartan®-IIE XA Field Programmable Gate Array (FPGA) in a 256‑ball LBGA package. It provides a balanced combination of logic capacity, on-chip memory and high pin-count I/O for embedded and control-oriented designs.

With 3,888 logic elements, approximately 49,152 bits of embedded RAM, 182 I/Os and AEC‑Q100 qualification, this device addresses applications that require moderate logic integration, substantial I/O connectivity and operation across wide temperature and supply ranges.

Key Features

• Core Logic  3,888 logic elements and an internal structure supporting up to 150,000 gates to implement custom digital functions.
• Embedded Memory  Approximately 0.048 Mbits (49,152 bits) of on-chip RAM for FIFOs, buffering and small data storage.
• I/O Capacity  182 general-purpose I/O pins to support extensive peripheral interfacing and board-level connectivity.
• Package & Mounting  256‑LBGA surface‑mount package (supplier package: 256‑FTBGA, 17×17) for compact board integration.
• Power  Core voltage supply range of 1.71 V to 1.89 V for predictable operating margins and power management.
• Temperature & Qualification  AEC‑Q100 qualification with an operating temperature range of −40 °C to 125 °C for use in temperature‑demanding environments.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Automotive Electronics  AEC‑Q100 qualification and wide operating temperature range make the device suitable for automotive electronic subsystems requiring programmable logic and I/O density.
• Embedded Control and Interface Bridging  Moderate logic capacity combined with 182 I/Os supports protocol bridging, glue logic and custom peripheral control in embedded systems.
• Harsh‑Environment Electronics  Operation from −40 °C to 125 °C enables deployment in temperature‑stressed environments where reliable programmable logic is needed.

Unique Advantages

• Automotive‑grade Qualification: AEC‑Q100 qualification provides a clear path for designs targeting automotive requirements.
• High I/O Count: 182 I/Os reduce the need for external interface chips, simplifying board design and lowering BOM cost.
• Balanced Logic and Memory: 3,888 logic elements paired with approximately 49,152 bits of on‑chip RAM supports a wide range of control and buffering tasks without immediate external memory.
• Compact Surface Mount Package: The 256‑LBGA package enables dense board layouts while maintaining robust connectivity.
• Wide Supply and Temperature Ranges: Defined core voltage range (1.71–1.89 V) and −40 °C to 125 °C operation help ensure predictable behavior across conditions.
• RoHS Compliant: Meets environmental compliance requirements for modern product designs.

Why Choose XA2S150E-6FT256Q?

The XA2S150E-6FT256Q offers a pragmatic mix of logic capacity, embedded memory and high I/O density in an automotive‑qualified FPGA package. Its specifications align with designs that need programmable logic close to sensors, actuators or high‑pin-count peripherals while operating across extended temperature ranges.

This device suits design teams seeking a compact, surface‑mount FPGA with defined power and thermal tolerances, reducing integration risk and supporting longer product lifecycles through qualification and environmental compliance.

If you would like pricing or availability, request a quote or submit an inquiry to receive a formal quotation and technical support for integrating XA2S150E-6FT256Q into your design.