RT4G150L-CGG1657V
| Part Description |
RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 1657-BFCCGA |
|---|---|
| Quantity | 119 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 52 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1657-CCGA (42.5x42.5) | Grade | Military | Operating Temperature | -55°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1657-BFCCGA | Number of I/O | 720 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | 151824 | Number of Logic Elements/Cells | 151824 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 5325 |
Overview of RT4G150L-CGG1657V – RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 1657-BFCCGA
The RT4G150L-CGG1657V is a flash-based RTG4™ FPGA optimized for high-reliability, high-performance embedded systems. Built around hardened logic elements and a resilient configuration architecture, the device targets demanding markets including space flight, high-altitude aviation, medical electronics and nuclear power plant control. Its architecture combines large logic capacity with on-chip memory, DSP resources and high-speed serial interfaces to support complex signal processing and control applications.
Key Features
- Logic Capacity — 151,824 logic elements to implement extensive digital logic and control functions.
- Programmable Fabric — Each logic element includes a 4-input LUT and fast carry chains; the FPGA fabric supports operation up to 300 MHz as described in the device datasheet.
- On-Chip Memory — 5,325 bits of total embedded RAM for small data buffering and state storage within the fabric.
- DSP and Math Blocks — Embedded multiply-accumulate resources for digital signal processing workloads, with timing characterized up to 300 MHz in the datasheet.
- High-Speed Serial Interfaces — Native SerDes capability specified at 3.125 Gbps for serial links; memory controllers support DDR2/DDR3/LPDDR interfaces as documented.
- I/O and Package — 720 user I/Os in a 1657-BFCCGA package (supplier device package: 1657-CCGA, 42.5 × 42.5 mm) suitable for dense pinout requirements.
- Power — Recommended supply voltage range of 1.14 V to 1.26 V for core operation.
- Thermal and Grade — Military-grade device with operating temperature range of −55 °C to 125 °C.
- Reliability in Harsh Environments — Architecture and documentation emphasize resistance to radiation-induced configuration upsets and single-event effects for high-reliability deployments.
- Regulatory — RoHS compliant.
Typical Applications
- Space Systems — On-board processing, telemetry and interface bridging in LEO/MEO/GEO/HEO and deep-space missions where radiation tolerance and reliable configuration are required.
- Aerospace & High-Altitude Platforms — Avionics signal processing and communication subsystems that benefit from hardened logic and wide operating temperatures.
- Medical Electronics — Control and processing functions in medical systems that require high reliability and deterministic digital processing.
- Nuclear Power Plant Control — Safety-related control, monitoring and data aggregation applications where resilience to harsh environments is essential.
Unique Advantages
- Hardened Configuration — Designed for resistance to radiation-induced single-event upsets, improving system reliability in radiation-prone environments.
- High Logic Density — 151,824 logic elements enable complex, system-level implementations on a single device, reducing board-level complexity.
- Comprehensive I/O Count — 720 user I/Os support wide parallel connectivity and multi-interface designs without excessive external multiplexing.
- High-Speed Serial and Memory Interfaces — Integrated SerDes and DDR memory controller support for high-bandwidth communication and external memory access.
- Extended Temperature and Military Grade — −55 °C to 125 °C operating range and military grading make the device suitable for mission-critical and rugged deployments.
- Documented Support — Detailed datasheet and technical briefs provide the electrical, timing and packaging information necessary for confident system integration.
Why Choose RT4G150L-CGG1657V?
The RT4G150L-CGG1657V positions itself as a high-reliability, high-capacity FPGA for applications that demand durable operation in harsh environments. With 151,824 logic elements, dedicated DSP resources, native SerDes and a broad I/O complement, it supports system consolidation, complex signal processing and high-bandwidth interfacing while maintaining a radiation-resistant configuration architecture.
This device is well suited to engineers developing avionics, spaceflight, medical and industrial safety systems who need documented electrical characteristics, thermal limits and interface capabilities to design robust, long-life products.
Request a quote or submit a sales inquiry to evaluate RT4G150L-CGG1657V for your next high-reliability FPGA design.

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