RT4G150L-CGG1657PROTO
| Part Description |
RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 1657-BFCCGA |
|---|---|
| Quantity | 1,168 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 32 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1657-CCGA (42.5x42.5) | Grade | Military | Operating Temperature | -55°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1657-BFCCGA | Number of I/O | 720 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | 151824 | Number of Logic Elements/Cells | 151824 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 5325 |
Overview of RT4G150L-CGG1657PROTO – RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 1657-BFCCGA
The RT4G150L-CGG1657PROTO is a Microchip RTG4™ flash-based FPGA combining fourth-generation hardened fabric with high-performance interfaces on a single surface-mount device. Designed and specified for military-grade and radiation-challenging environments, the device targets space, high-altitude aviation, medical electronics, and nuclear control applications where configuration robustness and deterministic logic resources are required.
This device provides a large logic capacity with extensive I/O and integrated high-speed serial and memory interfaces while operating across a wide temperature and supply range to meet demanding embedded system requirements.
Key Features
- Core architecture Flash-based RTG4 FPGA fabric with 4-input LUTs (LUT4) and fast carry chains; logic fabric supports designs with up to 151,824 logic elements.
- Logic capacity 151,824 logic elements for implementing complex state machines, datapaths, and control logic.
- Embedded memory & DSP Total on-chip RAM: 5,325 bits (approximately 0.0053 Mbits). Embedded multiply-accumulate blocks support DSP operations up to 300 MHz as documented for the RTG4 family.
- High-speed serial and memory interfaces Native SerDes support up to 3.125 Gbps and integrated DDR2/DDR3/LPDDR memory controller capabilities as described for the RTG4 family.
- Radiation-tolerant configuration Fabric and registers are hardened by design against radiation-induced single-event upsets (SEUs), retaining configuration integrity in radiation-prone environments.
- I/O and package 720 I/O pins in a 1657-BFCCGA package (supplier device package 1657-CCGA, 42.5 × 42.5 mm) in a surface-mount form factor suitable for compact board designs.
- Power and thermal Recommended supply range 1.14 V to 1.26 V with an operating temperature range of –55 °C to 125 °C, supporting deployment in extreme thermal environments.
- System and configuration resources On-chip oscillator, clock conditioning circuits (CCCs), JTAG and system controller SPI functionality are provided as part of the RTG4 device feature set.
- Environmental compliance RoHS compliant to meet current material directives.
Typical Applications
- Space systems Radiation-resistant configuration and hardened registers make this FPGA suitable for Low-, Medium-, and Geostationary-Earth-Orbit payloads and other spaceflight electronics.
- High-altitude aviation Extended temperature range and robust configuration retention suit avionics and high-altitude sensor/communication systems.
- Medical electronics Deterministic logic and DSP-capable blocks support real-time signal processing and control functions in medical instrumentation operating in demanding environments.
- Nuclear power and industrial control Radiation-tolerant configuration and military-grade specification support control, monitoring, and safety-related implementations in radiation-exposed installations.
Unique Advantages
- Hardened configuration for radiation environments: Registers and configuration memory are designed to resist radiation-induced upsets, reducing the need for external mitigation mechanisms.
- High logic density: 151,824 logic elements allow consolidation of complex functions into a single FPGA, lowering system BOM and interconnect complexity.
- Integrated high-speed interfaces: Native SerDes (3.125 Gbps) and DDR memory controller support enable high-throughput communication and memory subsystems without additional bridge devices.
- Extended operating range: Support for –55 °C to 125 °C and a defined 1.14 V–1.26 V supply window facilitates reliable operation in extreme environments.
- Robust I/O and package options: 720 I/O in a 1657-ball CCGA package (42.5 × 42.5 mm) provides high pin-count connectivity in a standard surface-mount footprint.
- Comprehensive on-chip system resources: Built-in oscillator, clock conditioning circuits, JTAG and SPI-based system controller features simplify system integration and bring-up.
Why Choose RT4G150L-CGG1657PROTO?
The RT4G150L-CGG1657PROTO delivers a high-density, flash-based FPGA fabric with design features tailored for radiation-challenging and military-grade applications. With tens of thousands of logic elements, extensive I/O, hardened registers, and integrated SerDes and memory interface support, it enables consolidation of complex, high-reliability designs into a single package.
This device is suited for engineers and programs that require deterministic logic performance, radiation-tolerant configuration, and a broad operating envelope. Documentation and technical details provided in the RTG4 family datasheet support integration, qualification, and long-term deployment in demanding embedded systems.
Request a quote or submit an inquiry for pricing and availability to evaluate the RT4G150L-CGG1657PROTO for your next mission-critical design.

Date Founded: 1989
Headquarters: Chandler, Arizona, USA
Employees: 22,000+
Revenue: $8.349 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D