RT4G150L-CGG1657PROTO

RT4G150L-CGG1657PROTO
Part Description

RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 1657-BFCCGA

Quantity 1,168 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time32 Weeks
Datasheet

Specifications & Environmental

Device Package1657-CCGA (42.5x42.5)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case1657-BFCCGANumber of I/O720Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBs151824Number of Logic Elements/Cells151824
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits5325

Overview of RT4G150L-CGG1657PROTO – RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 1657-BFCCGA

The RT4G150L-CGG1657PROTO is a Microchip RTG4™ flash-based FPGA combining fourth-generation hardened fabric with high-performance interfaces on a single surface-mount device. Designed and specified for military-grade and radiation-challenging environments, the device targets space, high-altitude aviation, medical electronics, and nuclear control applications where configuration robustness and deterministic logic resources are required.

This device provides a large logic capacity with extensive I/O and integrated high-speed serial and memory interfaces while operating across a wide temperature and supply range to meet demanding embedded system requirements.

Key Features

  • Core architecture Flash-based RTG4 FPGA fabric with 4-input LUTs (LUT4) and fast carry chains; logic fabric supports designs with up to 151,824 logic elements.
  • Logic capacity 151,824 logic elements for implementing complex state machines, datapaths, and control logic.
  • Embedded memory & DSP Total on-chip RAM: 5,325 bits (approximately 0.0053 Mbits). Embedded multiply-accumulate blocks support DSP operations up to 300 MHz as documented for the RTG4 family.
  • High-speed serial and memory interfaces Native SerDes support up to 3.125 Gbps and integrated DDR2/DDR3/LPDDR memory controller capabilities as described for the RTG4 family.
  • Radiation-tolerant configuration Fabric and registers are hardened by design against radiation-induced single-event upsets (SEUs), retaining configuration integrity in radiation-prone environments.
  • I/O and package 720 I/O pins in a 1657-BFCCGA package (supplier device package 1657-CCGA, 42.5 × 42.5 mm) in a surface-mount form factor suitable for compact board designs.
  • Power and thermal Recommended supply range 1.14 V to 1.26 V with an operating temperature range of –55 °C to 125 °C, supporting deployment in extreme thermal environments.
  • System and configuration resources On-chip oscillator, clock conditioning circuits (CCCs), JTAG and system controller SPI functionality are provided as part of the RTG4 device feature set.
  • Environmental compliance RoHS compliant to meet current material directives.

Typical Applications

  • Space systems Radiation-resistant configuration and hardened registers make this FPGA suitable for Low-, Medium-, and Geostationary-Earth-Orbit payloads and other spaceflight electronics.
  • High-altitude aviation Extended temperature range and robust configuration retention suit avionics and high-altitude sensor/communication systems.
  • Medical electronics Deterministic logic and DSP-capable blocks support real-time signal processing and control functions in medical instrumentation operating in demanding environments.
  • Nuclear power and industrial control Radiation-tolerant configuration and military-grade specification support control, monitoring, and safety-related implementations in radiation-exposed installations.

Unique Advantages

  • Hardened configuration for radiation environments: Registers and configuration memory are designed to resist radiation-induced upsets, reducing the need for external mitigation mechanisms.
  • High logic density: 151,824 logic elements allow consolidation of complex functions into a single FPGA, lowering system BOM and interconnect complexity.
  • Integrated high-speed interfaces: Native SerDes (3.125 Gbps) and DDR memory controller support enable high-throughput communication and memory subsystems without additional bridge devices.
  • Extended operating range: Support for –55 °C to 125 °C and a defined 1.14 V–1.26 V supply window facilitates reliable operation in extreme environments.
  • Robust I/O and package options: 720 I/O in a 1657-ball CCGA package (42.5 × 42.5 mm) provides high pin-count connectivity in a standard surface-mount footprint.
  • Comprehensive on-chip system resources: Built-in oscillator, clock conditioning circuits, JTAG and SPI-based system controller features simplify system integration and bring-up.

Why Choose RT4G150L-CGG1657PROTO?

The RT4G150L-CGG1657PROTO delivers a high-density, flash-based FPGA fabric with design features tailored for radiation-challenging and military-grade applications. With tens of thousands of logic elements, extensive I/O, hardened registers, and integrated SerDes and memory interface support, it enables consolidation of complex, high-reliability designs into a single package.

This device is suited for engineers and programs that require deterministic logic performance, radiation-tolerant configuration, and a broad operating envelope. Documentation and technical details provided in the RTG4 family datasheet support integration, qualification, and long-term deployment in demanding embedded systems.

Request a quote or submit an inquiry for pricing and availability to evaluate the RT4G150L-CGG1657PROTO for your next mission-critical design.

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