RT4G150L-CQG352B

RT4G150L-CQG352B
Part Description

RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 352-BFCQFP Exposed Pad and Tie Bar

Quantity 1,829 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time38 Weeks
Datasheet

Specifications & Environmental

Device Package352-QFP (48x48)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case352-BFCQFP Exposed Pad and Tie BarNumber of I/O166Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBs151824Number of Logic Elements/Cells151824
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits5325

Overview of RT4G150L-CQG352B – RTG4™ Field Programmable Gate Array (FPGA) IC

The RT4G150L-CQG352B is a Microchip RTG4™ flash-based FPGA designed for applications that require radiation-resistant configuration and high-performance programmable logic. The device integrates a hardened FPGA fabric with high-speed interfaces and embedded DSP/memory resources, addressing markets such as space flight, high-altitude aviation, medical electronics and nuclear power plant control as described in the product datasheet.

With 151,824 logic elements, native SerDes, and embedded memory and DSP resources, this RTG4 device targets systems that need deterministic logic performance, on-chip processing capability, and a package suitable for surface-mount deployment in demanding thermal and environmental conditions.

Key Features

  • Core FPGA Fabric — 151,824 logic elements (logic element cells) with LUT4-based logic and fast carry chains; architecture supports fabric operation up to 300 MHz as described in the datasheet.
  • Embedded Memory & DSP — Approximately 5,325 bits of total on-chip RAM and integrated multiply-accumulate blocks for DSP workloads, with DSP timing characterized up to 300 MHz.
  • High-speed Serial and Memory Interfaces — Native SerDes supporting 3.125 Gbps serial links and on-chip DDR2/DDR3/LPDDR memory controller support as documented in the datasheet.
  • Radiation Resistance & Reliability — Flash-based configuration with registers and logic hardened by design against single-event upsets (SEUs), intended for operation in radiation-prone environments including space flight and high-altitude applications.
  • I/O and Package — 166 user I/Os in a 352-BFCQFP exposed pad package with tie bar; supplier device package listed as 352-QFP (48×48); surface-mount mounting.
  • Power and Temperature — Supply voltage range 1.14 V to 1.26 V; rated operating temperature −55 °C to 125 °C; specified as Military grade in product data.
  • Compliance — RoHS compliant as indicated in the product data.

Typical Applications

  • Space and High-Altitude Systems — Radiation-resistant configuration and SEU-hardened registers make this FPGA suitable for on-board processing, telemetry, and control in LEO/MEO/GEO/HEO and deep-space missions.
  • Avionics and Aerospace Electronics — Deterministic FPGA fabric and high-speed serial links enable sensor aggregation, protocol bridging, and real-time data handling for flight systems.
  • Medical and Nuclear Control Systems — Hardened configuration and extended temperature range support deployment in medical instrumentation and nuclear plant control electronics that require robust operation under challenging conditions.

Unique Advantages

  • Radiation-Hardened Architecture: Flash-based FPGA fabric and registers hardened against SEUs reduce the need for external mitigation and simplify reliable system design in radiation environments.
  • High Logic Density: 151,824 logic elements provide substantial on-chip programmable resources for complex control, signal processing and protocol implementations without excessive external logic.
  • Integrated High-Speed Interfaces: Native SerDes at 3.125 Gbps and on-chip DDR2/DDR3/LPDDR controller support reduce external component count and simplify board-level design for high-bandwidth applications.
  • Robust Thermal and Voltage Window: Operation from −55 °C to 125 °C and a defined supply range (1.14 V–1.26 V) support deployment in harsh thermal and electrical environments.
  • Industry-Standard Packaging: 352-BFCQFP exposed pad package with tie bar and 352-QFP (48×48) supplier package footprint support surface-mount production and thermal management through the exposed pad.
  • Regulatory Compliance: RoHS compliance facilitates use in assemblies that require lead-free, environmentally conscious components.

Why Choose RT4G150L-CQG352B?

The RT4G150L-CQG352B combines a high-density, LUT4-based FPGA fabric with radiation-hardened design, integrated DSP and memory resources, and native high-speed serial interfaces to address demanding embedded processing and control applications. Its specified operating temperature range, military grade designation, and surface-mount 352-BFCQFP package make it suitable for mission-critical systems that require both performance and environmental robustness.

This device is well suited for engineers designing systems for aerospace, avionics, medical instrumentation, and nuclear control where on-chip processing, deterministic timing up to 300 MHz, and resilience to radiation-induced configuration upsets are required. The RTG4 architecture and Microchip datasheet support offer a clear path for designs that need scalability, reliability, and integrated high-speed interfaces.

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