RT4G150L-CGG1657M

RT4G150L-CGG1657M
Part Description

RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 1657-BFCCGA

Quantity 7 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time32 Weeks
Datasheet

Specifications & Environmental

Device Package1657-CCGA (42.5x42.5)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case1657-BFCCGANumber of I/O720Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBs151824Number of Logic Elements/Cells151824
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits5325

Overview of RT4G150L-CGG1657M – RTG4™ FPGA, 151,824 logic elements (Military Grade)

The RT4G150L-CGG1657M is a military-grade, flash-based RTG4 FPGA from Microchip Technology. It integrates hardened FPGA fabric and high-performance interfaces designed for systems that require resistance to radiation-induced configuration upsets and reliable operation across a wide temperature range.

Built for demanding environments such as space flight, high-altitude aviation, medical electronics and nuclear power plant control, this device delivers high logic density, extensive I/O capability and on-chip DSP resources in a 1657-BFCCGA surface-mount package.

Key Features

  • Core & architecture — Flash-based RTG4 FPGA fabric with registers hardened against radiation-induced single-event upsets (SEUs), supporting robust configuration in harsh environments.
  • Logic density — 151,824 logic elements (cells) providing substantial programmable logic resources for complex designs. Each logic element includes a 4-input LUT and fast carry chains for high-performance implementation.
  • On-chip memory — 5,325 total RAM bits on the device; the RTG4 family also provides multiple embedded memory options across the architecture.
  • DSP and timing — Embedded multiply-accumulate blocks and DSP resources capable of operation up to 300 MHz as specified for the RTG4 family.
  • High-speed serial interfaces — Native SerDes capability at 3.125 Gbps for high-throughput serial links; memory controllers for DDR2/DDR3/LPDDR interfaces are available in the family.
  • I/O and packaging — 720 user I/Os; supplied in a 1657-BFCCGA package (supplier device package 1657-CCGA, 42.5 × 42.5 mm); surface-mount mounting type.
  • Electrical and environmental — Nominal voltage supply range 1.14 V to 1.26 V; operating temperature range −55 °C to 125 °C; RoHS compliant and specified as Military grade.

Typical Applications

  • Space systems — Radiation-resistant configuration and hardened registers make this FPGA suitable for low-, medium- and geostationary-earth-orbit platforms and deep-space missions described for the RTG4 family.
  • High-altitude aviation — Wide temperature range and SEU-hardened logic support avionics and flight electronics operating in demanding thermal and radiation conditions.
  • Medical electronics — Reliable configuration and robust logic resources for medical devices requiring long-term stability in critical environments.
  • Power and nuclear control — Hardened registers and wide operating temperature range support control systems in nuclear power and other energy applications where resilience is required.

Unique Advantages

  • Radiation-hardened configuration: Registers are hardened by design against SEUs, reducing the risk of configuration upsets in radiation-prone environments.
  • High logic capacity: 151,824 logic elements enable implementation of complex control, signal-processing and interface functions on a single device.
  • Integrated high-speed interfaces: Native 3.125 Gbps SerDes and family-level memory controllers simplify board-level interface design for high-throughput systems.
  • Wide temperature and military grade: Specified for −55 °C to 125 °C and designated Military grade for use in harsh, mission-critical applications.
  • Compact, high-pin package: 1657-BFCCGA / 1657-CCGA (42.5 × 42.5 mm) package with 720 I/Os provides flexible routing and system integration options in a surface-mount form factor.
  • Compliance and traceability: RoHS compliant and supplied by Microchip Technology with datasheet and family documentation for design and verification.

Why Choose RT4G150L-CGG1657M?

The RT4G150L-CGG1657M combines a high logic element count with SEU-hardened storage and high-speed serial and memory interface support from the RTG4 family. Its military-grade specification, wide operating temperature window and surface-mount 1657 package make it suitable for applications where reliability and resistance to radiation effects are essential.

This device is well suited to engineering teams building mission-critical systems that require deterministic performance, extensive I/O, and on-chip DSP resources while leveraging Microchip’s RTG4 architecture and documentation for system-level integration.

Request a quote or submit an inquiry to receive pricing and availability information for RT4G150L-CGG1657M and to discuss specific procurement or design requirements.

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