RT4G150L-CGG1657M
| Part Description |
RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 1657-BFCCGA |
|---|---|
| Quantity | 7 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 32 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1657-CCGA (42.5x42.5) | Grade | Military | Operating Temperature | -55°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1657-BFCCGA | Number of I/O | 720 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | 151824 | Number of Logic Elements/Cells | 151824 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 5325 |
Overview of RT4G150L-CGG1657M – RTG4™ FPGA, 151,824 logic elements (Military Grade)
The RT4G150L-CGG1657M is a military-grade, flash-based RTG4 FPGA from Microchip Technology. It integrates hardened FPGA fabric and high-performance interfaces designed for systems that require resistance to radiation-induced configuration upsets and reliable operation across a wide temperature range.
Built for demanding environments such as space flight, high-altitude aviation, medical electronics and nuclear power plant control, this device delivers high logic density, extensive I/O capability and on-chip DSP resources in a 1657-BFCCGA surface-mount package.
Key Features
- Core & architecture — Flash-based RTG4 FPGA fabric with registers hardened against radiation-induced single-event upsets (SEUs), supporting robust configuration in harsh environments.
- Logic density — 151,824 logic elements (cells) providing substantial programmable logic resources for complex designs. Each logic element includes a 4-input LUT and fast carry chains for high-performance implementation.
- On-chip memory — 5,325 total RAM bits on the device; the RTG4 family also provides multiple embedded memory options across the architecture.
- DSP and timing — Embedded multiply-accumulate blocks and DSP resources capable of operation up to 300 MHz as specified for the RTG4 family.
- High-speed serial interfaces — Native SerDes capability at 3.125 Gbps for high-throughput serial links; memory controllers for DDR2/DDR3/LPDDR interfaces are available in the family.
- I/O and packaging — 720 user I/Os; supplied in a 1657-BFCCGA package (supplier device package 1657-CCGA, 42.5 × 42.5 mm); surface-mount mounting type.
- Electrical and environmental — Nominal voltage supply range 1.14 V to 1.26 V; operating temperature range −55 °C to 125 °C; RoHS compliant and specified as Military grade.
Typical Applications
- Space systems — Radiation-resistant configuration and hardened registers make this FPGA suitable for low-, medium- and geostationary-earth-orbit platforms and deep-space missions described for the RTG4 family.
- High-altitude aviation — Wide temperature range and SEU-hardened logic support avionics and flight electronics operating in demanding thermal and radiation conditions.
- Medical electronics — Reliable configuration and robust logic resources for medical devices requiring long-term stability in critical environments.
- Power and nuclear control — Hardened registers and wide operating temperature range support control systems in nuclear power and other energy applications where resilience is required.
Unique Advantages
- Radiation-hardened configuration: Registers are hardened by design against SEUs, reducing the risk of configuration upsets in radiation-prone environments.
- High logic capacity: 151,824 logic elements enable implementation of complex control, signal-processing and interface functions on a single device.
- Integrated high-speed interfaces: Native 3.125 Gbps SerDes and family-level memory controllers simplify board-level interface design for high-throughput systems.
- Wide temperature and military grade: Specified for −55 °C to 125 °C and designated Military grade for use in harsh, mission-critical applications.
- Compact, high-pin package: 1657-BFCCGA / 1657-CCGA (42.5 × 42.5 mm) package with 720 I/Os provides flexible routing and system integration options in a surface-mount form factor.
- Compliance and traceability: RoHS compliant and supplied by Microchip Technology with datasheet and family documentation for design and verification.
Why Choose RT4G150L-CGG1657M?
The RT4G150L-CGG1657M combines a high logic element count with SEU-hardened storage and high-speed serial and memory interface support from the RTG4 family. Its military-grade specification, wide operating temperature window and surface-mount 1657 package make it suitable for applications where reliability and resistance to radiation effects are essential.
This device is well suited to engineering teams building mission-critical systems that require deterministic performance, extensive I/O, and on-chip DSP resources while leveraging Microchip’s RTG4 architecture and documentation for system-level integration.
Request a quote or submit an inquiry to receive pricing and availability information for RT4G150L-CGG1657M and to discuss specific procurement or design requirements.

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