RT4G150-LGG1657R

The RT4G150-LGG1657R is a flash-based RTG4™ FPGA from Microchip Technology designed for demanding, radiation-prone environments. It integrates fourth‑generation flash FPGA fabric with hardened logic and high-performance I/O, delivering a programmable platform for space, high-altitude avionics, medical electronics, and nuclear-control applications.

This device provides a high logic capacity and dedicated DSP and memory resources with explicit operating and supply ranges suitable for extreme environments: 151,824 logic elements, 5,325 total RAM bits, up to 720 I/O, a 1.14–1.26 V core supply window, and an operating temperature range of -55 °C to 125 °C.

Key Features

• High Logic Capacity — 151,824 logic elements (registers) to implement complex FPGA designs and state-rich logic networks.
• Radiation-Resistant Fabric — Registers hardened by design against radiation-induced single-event upsets (SEUs), targeting use in harsh radiation environments such as space flight and high-altitude platforms.
• On‑Chip Memory and DSP — Total on-chip RAM of 5,325 bits and embedded multiply-accumulate resources for DSP workloads; fabric and DSP resources are specified for operation up to 300 MHz.
• High-Speed Serial and Memory Interfaces — Native SerDes capability at 3.125 Gbps and supported DDR2/DDR3/LPDDR memory controller interfaces for high-throughput link and memory designs.
• Robust I/O — Up to 720 I/O pins to support dense external connectivity and complex board-level interfacing.
• Electrical and Thermal — Core supply range of 1.14 V to 1.26 V with a wide operating temperature range of -55 °C to 125 °C for extreme-environment deployments.
• Package and Mounting — Supplied in a 1657-BCLGA (supplier device package 1657-CLGA, 42.5 × 42.5 mm) surface-mount package suitable for high-density PCB implementations.
• Grade and Compliance — Military grade device with RoHS compliance.

Typical Applications

• Space Systems — Radiation-resistant FPGA fabric and hardened registers enable reprogrammable processing and interface tasks in LEO, MEO, GEO, HEO and deep-space platforms.
• High-Altitude Avionics — High logic capacity, hardened configuration, and wide temperature range support avionics instrumentation and data-processing subsystems.
• Medical Electronics — Programmable DSP and I/O density support medical instrumentation that requires signal processing, control logic, and reliable operation in challenging environments.
• Nuclear Power and Industrial Control — Hardened registers and extended temperature operation make the device suitable for control and monitoring systems in nuclear and other harsh industrial settings.
• High-Speed Communications — Integrated 3.125 Gbps SerDes and memory interface support serial link aggregation, protocol bridging, and high-bandwidth telemetry.

Unique Advantages

• Radiation-Hardened Architecture: Registers hardened against SEUs provide design-level resilience for mission- and safety-critical deployments in radiation-prone environments.
• Large Programmable Capacity: 151,824 logic elements enable implementation of complex control, signal-processing, and interface logic without immediate need for external ASICs or co-processors.
• Integrated High-Speed I/O: Native SerDes at 3.125 Gbps and support for DDR2/DDR3/LPDDR memory controllers reduce external component count for high-throughput designs.
• Wide Environmental Range: -55 °C to 125 °C operating range and military grade classification support deployment in extreme-temperature and mission-critical applications.
• Compact, High-Density Packaging: 1657-BCLGA surface-mount package (42.5 × 42.5 mm) provides a dense footprint for board-level integration while offering up to 720 I/O.
• Controlled Supply Window: Defined core voltage range (1.14 V–1.26 V) helps in power-system design and qualification for sensitive platforms.

Why Choose RT4G150-LGG1657R?

The RT4G150-LGG1657R positions itself as a programmable, radiation-tolerant solution for applications that demand both high logic density and environmental robustness. With 151,824 logic elements, embedded DSP resources, high-speed SerDes, and hardened registers, this RTG4 device is aimed at engineers designing systems for space, avionics, medical, and nuclear environments where reprogrammability and reliability are required.

Backed by Microchip Technology's RTG4 family documentation and datasheet guidance, the RT4G150-LGG1657R offers a scalable FPGA platform that integrates logic, memory, and high-performance I/O in a military-grade, RoHS-compliant package—helping teams reduce system complexity while meeting strict environmental and reliability demands.

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