RT4G150-LGG1657B

RT4G150-LGG1657B
Part Description

RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 1657-BCLGA

Quantity 683 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time38 Weeks
Datasheet

Specifications & Environmental

Device Package1657-CLGA (42.5x42.5)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case1657-BCLGANumber of I/O720Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBs151824Number of Logic Elements/Cells151824
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits5325

Overview of RT4G150-LGG1657B – RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 1657-BCLGA

The RT4G150-LGG1657B is a flash-based RTG4 FPGA from Microchip Technology, offering a hardened FPGA fabric with high‑performance serial and memory interfaces. Designed for use in radiation‑challenging and high-reliability environments, this device combines large logic capacity with on‑chip memory and DSP resources to support complex, performance‑sensitive designs.

This device is supplied in a 1657‑BCLGA surface‑mount package and is specified for a 1.14 V to 1.26 V supply and an operating temperature range of −55 °C to 125 °C, making it suitable for military‑grade applications that require robust thermal and electrical stability.

Key Features

  • Logic Capacity — 151,824 logic elements provide substantial fabric resources for register, control and datapath implementations.
  • Embedded Memory — Approximately 5,325 bits of on‑chip RAM available for small, fast storage and buffering needs.
  • DSP and Math Blocks — Embedded multiply‑accumulate blocks support digital signal processing workloads with timing reported up to 300 MHz.
  • Programmable Logic Element Architecture — Each logic element includes a 4‑input LookUp Table (LUT4) with fast carry chains for efficient arithmetic and combinatorial logic.
  • High‑Speed SerDes — Native SerDes capability at 3.125 Gbps for high‑speed serial links and board‑level connectivity.
  • Memory Interface Support — On‑chip controllers for DDR2, DDR3 and LPDDR memory interfaces to simplify external memory integration.
  • I/O and Package — 720 I/O pins in a 1657‑BCLGA (supplier package 1657‑CLGA, 42.5 × 42.5 mm) surface‑mount package for dense system routing.
  • Power and Thermal — Nominal core supply range 1.14 V to 1.26 V; rated for continuous operation from −55 °C to 125 °C.
  • System Reliability — Flash‑based fabric hardened by design to resist radiation‑induced configuration upsets, including SEU mitigation for space, aviation and other harsh environments.
  • Compliance — RoHS compliant and supplied as military grade.

Typical Applications

  • Space Systems — FPGA fabric hardened against radiation‑induced configuration upsets for LEO, MEO, GEO, HEO and deep‑space flight applications.
  • High‑Altitude Aviation — Deterministic logic and SERDES interfaces for avionics processing and high‑reliability communication links.
  • Medical Electronics — Radiation‑resistant programmable logic for medical instrumentation where configuration integrity is critical.
  • Nuclear Power Control — Hardened logic and wide temperature capability for control systems in nuclear environments.
  • High‑Speed Data Transport and DSP — 3.125 Gbps SerDes and embedded MAC blocks for signal processing, serialization and high‑speed data interfaces.

Unique Advantages

  • Radiation‑Hardened Configuration: Fabric hardened by design against SEUs to maintain configuration integrity in harsh radiation environments.
  • Large Logic Resource Pool: 151,824 logic elements enable complex control, signal processing and protocol implementations on a single device.
  • Balanced Performance and Integration: 4‑input LUTs with fast carry chains and DSP blocks provide efficient arithmetic throughput up to 300 MHz.
  • Comprehensive I/O and Memory Support: 720 I/Os plus DDR2/DDR3/LPDDR controller support and native SerDes at 3.125 Gbps reduce external interface complexity.
  • Military Grade and Wide Temperature Range: −55 °C to 125 °C operating range and military grade specification support deployment in demanding environments.
  • RoHS Compliant Packaging: Supplied in a compact 1657‑BCLGA surface‑mount package (42.5 × 42.5 mm) for board‑level density and manufacturability.

Why Choose RT4G150-LGG1657B?

The RT4G150-LGG1657B is positioned for designs that require a combination of substantial logic resources, radiation‑resilient configuration, and high‑speed I/O. Its mix of LUT4-based logic elements, DSP blocks, SerDes and memory controller support makes it suitable for aerospace, avionics, medical and nuclear control applications where reliability and predictable performance matter.

Backed by Microchip’s RTG4 family documentation and technical materials, this device delivers a scalable FPGA platform for systems engineers and procurement teams seeking a militarily graded, RoHS‑compliant FPGA with explicit support for high‑reliability deployments.

Request a quote or submit an RFQ today to obtain pricing, availability and lead‑time information for the RT4G150-LGG1657B.

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